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Electrodeposition of tin: a simple approach

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Abstract

Electroplating of tin from acidic plating solutions has been studied for more than one hundred years. The plating solutions contain various additives in addition to stannous ions, which make them complicated and difficult to control. In this work, a simple tin plating solution has been developed. The slightly acidic electrolyte contains only two components: tin (II) chloride and tri-ammonium citrate. It is environmentally benign, easy to prepare, easy to control and electrodeposition can be done at room temperature. Plating rates in excess of 20 μm/h at a current density of 10 mA/cm2 are attainable from solutions with 0.31–0.41 mol/L (75–100 g/L) of tri-ammonium citrate and 0.22 mol/L (50 g/L) of SnCl2·2H2O. The resultant deposits are dense with smooth morphology.

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Acknowledgments

The authors are grateful to the Natural Sciences and Engineering Research Council (NSERC) of Canada for providing research funding and Micralyne for providing metallized Si wafers for electrodeposition.

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Authors and Affiliations

  1. Department of Chemical and Materials Engineering, University of Alberta, Edmonton, AB, Canada, T6G 2G6

    Anqiang He, Qi Liu & Douglas G. Ivey

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  1. Anqiang He
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  2. Qi Liu
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  3. Douglas G. Ivey
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Correspondence to Douglas G. Ivey.

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He, A., Liu, Q. & Ivey, D.G. Electrodeposition of tin: a simple approach. J Mater Sci: Mater Electron 19, 553–562 (2008). https://doi.org/10.1007/s10854-007-9385-3

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  • DOI: https://doi.org/10.1007/s10854-007-9385-3

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