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Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

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Abstract

In recent years, the pollution of environment from lead (Pb) and Pb-containing compounds in microelectronic devices attracts more and more attentions in academia and industry, the lead-free solder alloys begin to replace the lead-based solders in packaging process of some devices and components. In this work, microstructures and mechanical properties of the lead-free solder alloy Sn99.3Cu0.7(Ni) are investigated. This paper will compare the mechanical properties of the lead-based with lead-free solder alloys (Sn99.3Cu0.7(Ni) and 63Sn37Pb). The tensile tests of lead-based and lead-free solder alloys (Sn99.3Cu0.7(Ni) and Sn63Pb37) were conducted at room and elevated temperature at constant strain rate; the relevant tensile properties of Sn99.3Cu0.7(Ni) and Sn63Pb37 were obtained. Specifically, the tensile strength of this lead-free solder- Sn99.3Cu0.7(Ni) in 25∘C, 50∘C, 75∘C, 100∘C, 125∘C was investigated; and it was found that tensile strength of the lead-free solder decreased with the increasing test temperature at constant strain rate, showing strong temperature dependence. The lead-free solder alloy Sn99.3Cu0.7(Ni) was found to have favorable mechanical properties and it may be able to replace the lead-based solder alloy such as Sn63Pb37 in the packaging processes in microelectronic industry.

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Authors and Affiliations

  1. Institute of Microsystems, School of Mechanical Science and Engineering, HuaZhong University of Science and Technology, 1037 Luoyu Road, Wuhan, 430074, P. R. China

    Fulong Zhu, Honghai Zhang, Rongfeng Guan & Sheng Liu

  2. Dept. of Mechanical Engineering, Wayne state university, Detroit, Michigan, 48202, USA

    Rongfeng Guan

  3. Institute of Materials Science and Engineering, Henan Polytechnic University, Jiaozuo, Henan province, 454000, P. R. China

    Sheng Liu

Authors
  1. Fulong Zhu
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  2. Honghai Zhang
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  3. Rongfeng Guan
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  4. Sheng Liu
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Correspondence to Fulong Zhu.

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Zhu, F., Zhang, H., Guan, R. et al. Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy. J Mater Sci: Mater Electron 17, 379–384 (2006). https://doi.org/10.1007/s10854-006-7474-3

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  • DOI: https://doi.org/10.1007/s10854-006-7474-3

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