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Corrosion behavior of Sn-based lead-free solder alloys: a review

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Abstract

Sn-based lead-free solder alloys have been investigated widely to replace the traditional Sn–Pb solder alloys. Since the miniaturization of electronic products and the expansion of application field, the corrosion resistance of solder alloys play a key factor in the reliability of electronic products in long-term service. In this article, we review the recent progress on the corrosion behavior of Sn-based lead-free solder alloys by summarizing the results in representative ones of Sn–Bi, Sn–Cu, Sn–Zn, Sn–Ag, Sn–Ag–Cu and other multi-elements lead-free solder alloys. Specifically, the relationship between microstructure morphology and corrosion behavior, the corrosion mechanism of Sn-based lead-free solder alloys after incorporation of alloy elements or particles are summarized. It is hoped that this overview will provide some useful information in clarifying the corrosion mechanism and development of lead-free solder alloys. Furthermore, remaining difficulties and future trends in this research field are proposed.

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Acknowledgments

This research was funded by Research Foundation for High-level talent Scholars in North China University of Water Resources and Electric Power (No. 201811034) and Open Fund of National Joint Engineering Research Center for abrasion control and molding of metal materials (No. HKDNM2019020).

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Authors and Affiliations

  1. School of Mechanical Engineering, North China University of Water Resources and Electric Power, Zhengzhou, 450045, China

    Shuai Li, Xingxing Wang, Zhongying Liu & Shengjin Wu

  2. State Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou, 450001, China

    Yongtao Jiu & Weimin Long

  3. State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin, 150001, China

    Shuye Zhang & Peng He

  4. Electric Power Research Institute, State Grid Henan Electric Power Company, Zhengzhou, 450052, China

    Jinfeng Geng

  5. Key Laboratory of Surface Engineering of Equipment for Hydraulic Engineering of Zhejiang Province, Standard & Quality Control Research Institute, Ministry of Water Resources, Hangzhou, 310012, China

    Xiaoming Chen

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  1. Shuai Li
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Li, S., Wang, X., Liu, Z. et al. Corrosion behavior of Sn-based lead-free solder alloys: a review. J Mater Sci: Mater Electron 31, 9076–9090 (2020). https://doi.org/10.1007/s10854-020-03540-2

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