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Copper plating on water-soluble NaCl particles by evaporative crystallization and its effect on the pore structure of infiltrated AlSi12 alloy foam

  • Metals & corrosion
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Abstract

A new evaporative crystallization method was used to plate copper on water-soluble NaCl particles. Cu(NO3)2·3H2O was crystallized on NaCl particles by the heated ethanol volatilization, and then thermally decomposed to obtain CuO coating which was finally reduced to Cu coating. The affecting factors of coating effect and the influence of copper-plated NaCl particles on the pores structure of infiltrated AlSi12 foam were studied. The thermal oxidation pretreatment of NaCl particles increased the number of oxygen-containing functional groups and the uniform distribution of thermal etch pits, which improved the bonding strength between NaCl particles and Cu(NO3)2·3H2O coating. The addition of Tween-60 and PEG-6000 inhibited the micro-dissolution of NaCl particles in ethanol and promoted the formation of complete CuO coating. Infiltrated AlSi12 foam prepared from copper-plated NaCl particles had a more homogeneous pore structure and smaller pore size deviations than infiltrated AlSi12 foam obtained with uncoated NaCl particles, indicating that copper plating significantly improved the wettability of NaCl particles and AlSi12 alloy melt. This paper presents a new and low-cost surface treatment method, which provides a useful reference for the surface modification and application of water-soluble particles.

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Data availability

The data that support the findings of this study are available from the corresponding author upon reasonable request.

References

  1. Cao L, Fu Q, Si Y et al (2018) Porous materials for sound absorption. Compos Commun 10:25–35. https://doi.org/10.1016/j.coco.2018.05.001

    Article  Google Scholar 

  2. Guiping C, Deping H, Guangji S (2001) Underwater sound absorption property of porous aluminum. Colloids Surf A 179:191–194. https://doi.org/10.1016/S0927-7757(00)00656-7

    Article  Google Scholar 

  3. Banhart J (2006) Metal foams: production and stability. Adv Eng Mater 8:781–794. https://doi.org/10.1002/adem.200600071

    Article  CAS  Google Scholar 

  4. Parveez B, Jamal NA, Maleque A et al (2021) Review on advances in porous Al composites and the possible way forward. J Market Res 14:2017–2038. https://doi.org/10.1016/j.jmrt.2021.07.055

    Article  CAS  Google Scholar 

  5. Srinath G, Vadiraj A, Balachandran G et al (2010) Characteristics of aluminium metal foam for automotive applications. Trans Indian Inst Met 63:765–772. https://doi.org/10.1007/s12666-010-0117-7

    Article  CAS  Google Scholar 

  6. Covaciu M, Walczak M, Ramos-Grez J (2011) A method for manufacturing cellular metals with open- and close-type porosities. Mater Lett 65:2947–2950. https://doi.org/10.1016/j.matlet.2011.06.064

    Article  CAS  Google Scholar 

  7. Chang K, Gao J-T, Wang Z, Guo Z-C (2018) Manufacturing 3-D open-cell aluminum foam via infiltration casting in a super-gravity field. J Mater Process Technol 252:705–710. https://doi.org/10.1016/j.jmatprotec.2017.10.032

    Article  CAS  Google Scholar 

  8. Kou DP, Li JR, Yu JL, Cheng HF (2008) Mechanical behavior of open-cell metallic foams with dual-size cellular structure. Scr Mater 59:483–486. https://doi.org/10.1016/j.scriptamat.2008.04.022

    Article  CAS  Google Scholar 

  9. Wang H, Zhou X, Long B et al (2014) Thermal properties of open-celled aluminum foams prepared by two infiltration casting methods. J Cent South Univ 21:2567–2571. https://doi.org/10.1007/s11771-014-2213-z

    Article  CAS  Google Scholar 

  10. Wan T, Liu Y, Zhou C et al (2021) Fabrication, properties, and applications of open-cell aluminum foams: a review. J Mater Sci Technol 62:11–24. https://doi.org/10.1016/j.jmst.2020.05.039

    Article  CAS  Google Scholar 

  11. Cheng J, Gan X, Chen S et al (2019) Properties and microstructure of copper/nickel-iron-coated graphite composites prepared by electroless plating and spark plasma sintering. Powder Technol 343:705–713. https://doi.org/10.1016/j.powtec.2018.11.057

    Article  CAS  Google Scholar 

  12. Liu Q, He X-B, Ren S-B et al (2014) Thermophysical properties and microstructure of graphite flake/copper composites processed by electroless copper coating. J Alloy Compd 587:255–259. https://doi.org/10.1016/j.jallcom.2013.09.207

    Article  CAS  Google Scholar 

  13. Liu J, Zhang Y, Feng C et al (2019) Study of copper chemical-plating modified polyacrylonitrile-based carbon fiber wick applied to compact loop heat pipe. Exp Thermal Fluid Sci 100:104–113. https://doi.org/10.1016/j.expthermflusci.2018.07.008

    Article  CAS  Google Scholar 

  14. Wang Y, Bian C, Jing X (2013) Adhesion improvement of electroless copper plating on phenolic resin matrix composite through a tin-free sensitization process. Appl Surf Sci 271:303–310. https://doi.org/10.1016/j.apsusc.2013.01.188

    Article  CAS  Google Scholar 

  15. Ghaziof S, Gao W (2015) The effect of pulse electroplating on Zn–Ni alloy and Zn–Ni–Al2O3 composite coatings. J Alloy Compd 622:918–924. https://doi.org/10.1016/j.jallcom.2014.11.025

    Article  CAS  Google Scholar 

  16. Han W, Qian X, Ma H et al (2021) Effect of nickel electroplating followed by a further copper electroplating on the micro-structure and mechanical properties of high modulus carbon fibers. Mater Today Commun 27:102345. https://doi.org/10.1016/j.mtcomm.2021.102345

    Article  CAS  Google Scholar 

  17. Wan Y, Liu X, Hu X et al (2018) Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints. J Mater Sci Mater Electron 29:18404–18416. https://doi.org/10.1007/s10854-018-9955-6

    Article  CAS  Google Scholar 

  18. Gui C, Yao C, Huang J et al (2020) Preparation of polymer brush/Ni particle and its application in electroless copper plating on PA12 powder. Appl Surf Sci 506:144935. https://doi.org/10.1016/j.apsusc.2019.144935

    Article  CAS  Google Scholar 

  19. Wang L, Xu L, Srinivasakannan C et al (2018) Electroless copper plating of tungsten powders and preparation of WCu20 composites by microwave sintering. J Alloy Compd 764:177–185. https://doi.org/10.1016/j.jallcom.2018.06.061

    Article  CAS  Google Scholar 

  20. Kelly PJ, Arnell RD (2000) Magnetron sputtering: a review of recent developments and applications. Vacuum 56:159–172. https://doi.org/10.1016/S0042-207X(99)00189-X

    Article  CAS  Google Scholar 

  21. Tučkutė S, Urbonavičius M, Lelis M et al (2018) A new method of nanocrystalline nickel powder formation by magnetron sputtering on the water-soluble substrates. Mater Res Express 5:015017. https://doi.org/10.1088/2053-1591/aaa040

    Article  CAS  Google Scholar 

  22. Petukhov V, Bakin A, El-Shaer A-H et al (2007) Etch-pit density investigation on both polar faces of ZnO substrates. Electrochem Solid State Lett 10:H357. https://doi.org/10.1149/1.2789285

    Article  CAS  Google Scholar 

  23. Patel AR, Bahl OP, Vagh AS (1966) Loops and spirals on thermally etched surfaces of cleaved NaCl crystals. Jpn J Appl Phys 5:870–873. https://doi.org/10.1143/JJAP.5.870

    Article  CAS  Google Scholar 

  24. Koffyberg FP (1965) Etch pits and dislocations in SnO2 crystals. J Appl Phys 36:844–849. https://doi.org/10.1063/1.1714230

    Article  CAS  Google Scholar 

  25. Chang Y, Tao Y, Zhang Q, Yang Z-G (2015) Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes. Electrochim Acta 158:7–12. https://doi.org/10.1016/j.electacta.2015.01.161

    Article  CAS  Google Scholar 

  26. Huang J, Zhang Y, Yuan M et al (2019) A facile process to fabricate electroless plating on PET sheet: effects of surface roughness on adhesive force, electronic and structural properties of copper coating. J Taiwan Inst Chem Eng 97:406–413. https://doi.org/10.1016/j.jtice.2019.01.018

    Article  CAS  Google Scholar 

  27. Wang Y, Wang Y, Chen J et al (2016) A facile process combined with inkjet printing, surface modification and electroless deposition to fabricate adhesion-enhanced copper patterns on flexible polymer substrates for functional flexible electronics. Electrochim Acta 218:24–31. https://doi.org/10.1016/j.electacta.2016.08.143

    Article  CAS  Google Scholar 

  28. Liu W, Qiao X, Liu S et al (2019) A new process for pre-treatment of electroless copper plating on the surface of mica powders with ultrasonic and nano-nickel. J Alloy Compd 791:613–620. https://doi.org/10.1016/j.jallcom.2019.03.360

    Article  CAS  Google Scholar 

  29. Zhou X, Mao J, Qiao Z (2016) Electroless plating of copper layer on surfaces of urea–formaldehyde microcapsule particles containing paraffin for low infrared emissivity. Particuology 24:159–163. https://doi.org/10.1016/j.partic.2014.12.006

    Article  CAS  Google Scholar 

  30. Ma Y, Guo L, Qi L et al (2021) Growth mechanism and thermal behavior of electroless Cu plating on short carbon fibers. Surf Coat Technol 419:127294. https://doi.org/10.1016/j.surfcoat.2021.127294

    Article  CAS  Google Scholar 

  31. Kothekar SC, Ware AM, Waghmare JT, Momin SA (2007) Comparative analysis of the properties of Tween-20, Tween-60, Tween-80, Arlacel-60, and Arlacel-80. J Dispersion Sci Technol 28:477–484. https://doi.org/10.1080/01932690601108045

    Article  CAS  Google Scholar 

  32. Li Z, Zhou Q (2010) PEG-6000 assisted growth of copper dendrites. J Dispers Sci Technol 31:1401–1404. https://doi.org/10.1080/01932690903269545

    Article  CAS  Google Scholar 

  33. Ghose J, Kanungo A (1981) Studies on the thermal decomposition of Cu(NO3)2·3H2O. J Therm Anal 20:459–462. https://doi.org/10.1007/BF01912894

    Article  CAS  Google Scholar 

  34. Huang J, Tian C, Wang J et al (2018) Fabrication of selective electroless copper plating on PET sheet: effect of PET surface structure on resolution and adhesion of copper coating. Appl Surf Sci 458:734–742. https://doi.org/10.1016/j.apsusc.2018.07.119

    Article  CAS  Google Scholar 

  35. Sun X, Wu D, Zhu W et al (2020) In-situ atomic-scale visualization of autocatalytic reduction of CuO with H2. Microsc Microanal 26:3048–3050. https://doi.org/10.1017/S1431927620023648

    Article  Google Scholar 

  36. Liu B, Liu X, Liu M, Zhao Z (2011) Infiltration mechanism in SiCp/aluminum-matrix composite prepared by nonpressure. Mater Manuf Processes 26:1339–1345. https://doi.org/10.1080/10426914.2010.537420

    Article  CAS  Google Scholar 

  37. An Q, Cong X, Shen P, Jiang Q (2019) Roles of alloying elements in wetting of SiC by Al. J Alloy Compd 784:1212–1220. https://doi.org/10.1016/j.jallcom.2019.01.138

    Article  CAS  Google Scholar 

  38. Wu D, Wang P, Wu P et al (2015) Determination of contact angle of droplet on convex and concave spherical surfaces. Chem Phys 457:63–69. https://doi.org/10.1016/j.chemphys.2015.05.020

    Article  CAS  Google Scholar 

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Acknowledgements

This work was funded by the National Natural Science Foundation of China Projects (52261009), and by the Key Research and Development Project of Yunnan Province, China (2018BA072, 2019ZE008). The authors would also express their appreciation to the Analytical and Testing Centre of Yunnan Province, P.R. China.

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QX was contributed to software, formal analysis, data curation, writing—original draft, writing—review and editing. XZ was contributed to conceptualization, project administration, funding acquisition, writing—review and editing. JY was contributed to review and editing. YZ was contributed to review and editing. BH was contributed to review and editing.

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Correspondence to Xiaoqing Zuo.

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Handling Editor: Catalin Croitoru.

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Xia, Q., Zuo, X., Zhou, Y. et al. Copper plating on water-soluble NaCl particles by evaporative crystallization and its effect on the pore structure of infiltrated AlSi12 alloy foam. J Mater Sci 58, 9308–9321 (2023). https://doi.org/10.1007/s10853-023-08570-9

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