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Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

  • Metals & corrosion
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Abstract

Graphene nanosheets (GNSs) modified Sn58Bi and Cu-core Sn58Bi solder joints were manufactured in this work. The evolution of microstructure and growth of intermetallic compounds (IMCs) under current stressing were carefully investigated. The results show that the addition of GNSs aggravates the electromigration behavior in Sn58Bi solder joints, while it inhibits the mass transfer in Cu-core Sn58Bi solder joints. The effects of GNSs on the Bi migration were well discussed with the assistance of the finite element simulation. Furthermore, the local current density was calculated, considering the influence of microstructure, to analyze the formation of IMC particles existing in the solder matrix.

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Acknowledgements

This work was supported by the National Natural Science Foundation of China (51572190).

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Authors and Affiliations

  1. Tianjin Key Laboratory of Low Dimensional Materials Physics and Preparing Technology, Department of Applied Physics, Faculty of Science, Tianjin University, Tianjin, 300354, People’s Republic of China

    Peng Liu, Weiqi Guo & Ping Wu

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  1. Peng Liu
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  2. Weiqi Guo
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  3. Ping Wu
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Correspondence to Ping Wu.

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Liu, P., Guo, W. & Wu, P. Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint. J Mater Sci 57, 15598–15611 (2022). https://doi.org/10.1007/s10853-022-07590-1

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