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Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling

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Abstract

With electronic devices progressing into more miniaturized and intelligent, thermal cycling reliability of solder joint has always been an issue in high-density advanced packaging. In this study, minor amount of graphene nanosheets (GNSs) was added into Sn-1.0Ag-0.5Cu solder in order to enhance its thermal cycling reliability. Detailed relationship between mechanical behavior and microstructure evolution of the Sn-1.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu-GNSs solder joints was investigated. Experimental results indicated that Sn-1.0Ag-0.5Cu-GNSs had a lower decrease rate in shear force during thermal cycling when compared to the non-modified. This is due to a slower coarsening of microstructure and inhibited growth of interfacial IMCs. Theoretical analysis showed that with the addition of GNSs, the average growth coefficients of total interfacial IMCs (DT) was decreased from 8.6 × 10–11 to 6.7 × 10–11 cm2/h, respectively. This decrease in the average values of DT were mainly attributed to the pinning effect of GNSs on the the interfacial IMC growth during TC treatment. In addition, fracture mode of solder joints were also a good response to the mechanical change during thermal cycling treatment.

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Data availability

The datasets generated and analyzed during the current study are available from the first author on reasonable request.

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Funding

This work was financially supported by the National Natural Science Foundation of China (Grant No. 52105369, 12004194), Natural Science Foundation of the Jiangsu Higher Education Institutions of China (20KJB460008), the Natural Science Foundation of Jiangsu Province (Grant No. BK20200746), and Starting founding from Nanjing University of Posts and Telecommunications (NJUPTSF) (Grant No. NY220077). In addition, a high-level innovation research institute from Guangdong Greater Bay Area Institute of Integrated Circuit and System (No.2019B090909006) and the construction of new research and development institutions (No.2019B090904015) also supported the experiment.

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Authors and Affiliations

  1. College of Integrated Circuit Science and Engineering, Nanjing University of Posts and Telecommunications, Nanjing, 210003, China

    Jie Wu, Yiping Wu, Xiwu Huang, Rui Yu, Xuqi Yang, Guangyao Chen & Yong Xu

  2. Sino-French Institute of Nuclear Engineering and Technology, Sun Yat-Sen University, Zhuhai, 519082, China

    Guoqiang Huang

  3. Guangdong Greater Bay Area Institute of Integrated Circuit and System, Guangzhou, 510535, China

    Yong Xu

Authors
  1. Jie Wu
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  2. Guoqiang Huang
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  3. Yiping Wu
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  4. Xiwu Huang
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  5. Rui Yu
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  6. Xuqi Yang
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  7. Guangyao Chen
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  8. Yong Xu
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Contributions

Conceptualization: JW; Methodology: JW, GH; Formal analysis and investigation: GH, YW; Data curation: XH, RY; Writing-original draft preparation: JW; Writing-review and editing: GH; Funding acquisition: JW, YX; Supervision: GH, YX.

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Correspondence to Guoqiang Huang or Yong Xu.

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Wu, J., Huang, G., Wu, Y. et al. Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling. J Mater Sci: Mater Electron 34, 86 (2023). https://doi.org/10.1007/s10854-022-09488-9

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  • DOI: https://doi.org/10.1007/s10854-022-09488-9

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