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Response of microstructure to annealing in in situ Cu–Nb microcomposite

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Abstract

In this paper, the shape instabilities of Nb in in situ Cu–Nb microcomposite wires after exposed to different annealing treatments have been analyzed using scanning electron microscopy and transmission electron microscopy technologies. The results suggest that the thermal stability is related to misorientation among the adjacent grains at the triple joint. Most of the triple joints are composed of low-angle grain boundaries in Nb ribbons and Cu–Nb interfaces of (111)Cu//(011)Nb. These triple joints provide dragging force to interface motion so that neither the grains nor the interface boundaries show substantial changes below 500 °C. Above 500 °C, the Nb ribbons start to dissociate at the triple joints within Nb phase due to the stored energy by misorientation/distortion in Nb. Grooves and pits formed at these regions tend to promote the spheroidization of the Nb phase. Such results may enrich the studies on the microstructure evolution of Cu-based microcomposite.

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Notes

  1. Boundary splitting is a process where atoms migrate away from the sub-boundaries and the phase pinches off.

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Acknowledgements

The authors greatly acknowledge the support of the National High Magnetic Field Laboratory through US National Science Foundation Cooperative Agreement No. DMR-1157490. This research is also funded by the National Natural Science Foundation of China (Grant Nos. 51601039, 51301040, 51541103), the Danish National Research Foundation, the National Natural Science Foundation of China for Non-metals (Grant No. 51261130091), the Natural Science Foundation of Fujian Province, China (Grant No. 2016J05119), and the Collaborative Innovation Center of High-End Equipment Manufacturing in Fujian, China. Thanks are also given to Dr. Yan Xin, Dr. Yifeng Su, Dr. Xiaowei Zuo and Dr. Lei Qu for their assistance with the testing.

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Authors and Affiliations

  1. School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou, 350116, China

    Liping Deng, Bingshu Wang & Hongliang Xiang

  2. National High Magnetic Field Laboratory, Tallahassee, FL, 32310, USA

    Ke Han & Rongmei Niu

  3. Texas A&M University, College Station, TX, 77843, USA

    Karl T. Hartwig

  4. College of Materials Science and Engineering, Chongqing University, Chongqing, 400044, China

    Xiaofang Yang

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  1. Liping Deng
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  2. Bingshu Wang
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  3. Ke Han
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Correspondence to Liping Deng or Ke Han.

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Deng, L., Wang, B., Han, K. et al. Response of microstructure to annealing in in situ Cu–Nb microcomposite. J Mater Sci 54, 840–850 (2019). https://doi.org/10.1007/s10853-018-2865-4

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