Skip to main content
SpringerLink
Log in

Fabrication of highly electrical conductive composite filaments for 3D-printing circuits

  • Electronic materials
  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

For 3D-printing circuits, highly electrical conductive composite filaments were prepared through thin-film transition technique and hot extrusion-drawing. In the filaments, flaky silver powders with nanoscale thickness and smooth flat surface were used as electrical conductive phase, and thermoplastic polyvinyl butyral was used as binder phase. The thermal properties of the electrical conductive composites were studied by thermogravimetric analysis, X-ray diffraction, and Fourier transform infrared spectrophotometric. Results showed that the electrical conductive composites possessed highly thermal stability up to 350 °C. Moreover, the scanning electron microscopy revealed that thin-film transition technique made the flaky silver powders in the cured conductive films present a face-to-face contact pattern and the well-ordered orientation remain in the composite filaments, which could greatly decrease the volume resistivity of composite filaments. The as-prepared composite filaments showed a low volume resistivity of 7.02 × 10−4 Ω cm at only 55 wt% (11.08 vol%) of flaky silver powder filling rate. The solvent-free 3D printing used composite filaments show low volume resistivity and well mechanical properties that prove the potential application in 3D-printing circuits.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Figure 1
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Figure 9
Figure 10
Figure 11
Figure 12

Similar content being viewed by others

References

  1. Rim YS, Bae SH, Chen H, Marco ND, Yang Y (2016) Recent progress in materials and devices toward printable and flexible sensors. Adv Mater 28:4415–4440

    Article  Google Scholar 

  2. Zhu M, Huang Y, Huang Y, Li H, Wang Z, Pei Z et al (2017) A highly durable, transferable, and substrate-versatile high-performance all-polymer micro-supercapacitor with plug-and-play function. Adv Mater 29:1605137

    Article  Google Scholar 

  3. Tam SK, Fung KY, Ng KM (2017) High copper loading metal organic decomposition paste for printed electronics. J Mater Sci 52:5617–5625. https://doi.org/10.1007/s10853-017-0796-0

    Article  Google Scholar 

  4. Kölpin N, Wegener M, Teuber E, Polster S, Frey L, Roosen A (2013) Conceptional design of nano-particulate ITO inks for inkjet printing of electron devices. J Mater Sci 48:1623–1631. https://doi.org/10.1007/s10853-012-6919-8

    Article  Google Scholar 

  5. Mohammed MG, Kramer R (2017) All-printed flexible and stretchable electronics. Adv Mater 29:1604965

    Article  Google Scholar 

  6. Kwok SW, Goh KHH, Tan ZD, Tan STM, Tjiu WW, Soh JY et al (2017) Electrically conductive filament for 3D-printed circuits and sensors. Appl Mater Today 9:167–175

    Article  Google Scholar 

  7. Kennedy ZC, Christ JF, Evans KA, Arey BW, Sweet LE, Warner MG et al (2017) 3D-printed poly(vinylidene fluoride)/carbon nanotube composites as a tunable, low-cost chemical vapour sensing platform. Nanoscale 9:5458–5466

    Article  Google Scholar 

  8. Zhang D, Chi B, Li B, Gao Z, Du Y, Guo J et al (2016) Fabrication of highly conductive graphene flexible circuits by 3D printing. Synth Met 217:79–86

    Article  Google Scholar 

  9. Leigh SJ, Bradley RJ, Purssell CP, Billson DR, Hutchins DA (2012) A simple, low-cost conductive composite material for 3D printing of electronic sensors. PLoS ONE 7:e49365

    Article  Google Scholar 

  10. Zhang H, Zou G, Liu L, Tong H, Li Y, Bai H et al (2017) Synthesis of silver nanoparticles using large-area arc discharge and its application in electronic packaging. J Mater Sci 52:3375–3387. https://doi.org/10.1007/s10853-016-0626-9

    Article  Google Scholar 

  11. Jiu J, Zhang H, Nagao S, Sugahara T, Kagami N, Suzuki Y (2016) Die-attaching silver paste based on a novel solvent for high-power semiconductor devices. J Mater Sci 51:3422–3430. https://doi.org/10.1007/s10853-015-9659-8

    Article  Google Scholar 

  12. Faddoul R, Reverdy-Bruas N, Bourel J (2012) Silver content effect on rheological and electrical properties of silver pastes. J Mater Sci: Mater Electron 23:1415–1426

    Google Scholar 

  13. Park BG, Jung KH, Jung SB (2017) Fabrication of the hybrid Ag paste combined by Ag nanoparticle and micro Ag flake and its flexibility. J Alloy Compd 699:1186–1191

    Article  Google Scholar 

  14. Wang J, Chen Z, Hu Y, Jiang X, Chen D, Zhang W (2013) Flaky silver powders prepared with nanofilm transition method: application for printable electronics. J Mater Chem C 1:230–233

    Article  Google Scholar 

  15. Shen Y, Chen Z, Zhou T, Feng W, Liu Y (2016) Green preparation of flaky silver powders with nano-thickness towards electrically conductive adhesives through a nanofilm transition method. J Mater Chem C 4:254–258

    Article  Google Scholar 

  16. McKeen LW (2016) 5-pigments, fillers, and extenders, 2nd edn. Elsevier, Waltham

    Google Scholar 

  17. Kirchner E (2009) Film shrinkage and flake orientation. Prog Org Coat 65:333–336

    Article  Google Scholar 

  18. Tadjarodi A, Zabihi F (2013) Thermal conductivity studies of novel nanofluids based on metallic silver decorated mesoporous silica nanoparticles. Mater Res Bull 48:4150–4156

    Article  Google Scholar 

  19. Tan M, Wang X, Hao Y, Deng Y (2017) Novel Ag nanowire array with high electrical conductivity and fast heat transfer behavior as the electrode for film devices. J Alloy Compd 701:49–54

    Article  Google Scholar 

  20. Asiri AM, Hussein MA, Abu-Zied BM, Hermas AEA (2013) Effect of NiLaxFe2−xO4 nanoparticles on the thermal and coating properties of epoxy resin composites. Compos Part B Eng 51:11–18

    Article  Google Scholar 

  21. He X, Chen Y, Wang S, He W, Wang C, Zhang H et al (2018) Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core. Compos Part B Eng 138:232–242

    Article  Google Scholar 

  22. Goyal RK, Katkade SS, Mule DM (2013) Dielectric, mechanical and thermal properties of polymer/BaTiO3 composites for embedded capacitor. Compos Part B Eng 44:128–132

    Article  Google Scholar 

  23. Roy AS, Gupta S, Seethamraju S, Madras G, Ramamurthy PC (2014) Impedance spectroscopy of novel hybrid composite films of polyvinylbutyral (PVB)/functionalized mesoporous silica. Compos Part B Eng 58:134–139

    Article  Google Scholar 

  24. Corroyer E, Brochier-Salon MC, Chaussy D, Wery S, Belgacem MN (2013) Characterization of commercial polyvinylbutyrals. Int J Polym Anal Charact 18:346–357

    Article  Google Scholar 

  25. Jiang Y, Xu Z, Huang T, Liu Y, Guo F, Xi J et al (2018) Direct 3D printing of ultralight graphene oxide aerogel microlattices. Adv Funct Mater 28:1707024

    Article  Google Scholar 

  26. Krishnamoorti R, Ren J, Silva AS (2001) Shear response of layered silicate nanocomposites. J Chem Phys 114:4968–4973

    Article  Google Scholar 

  27. He S, Zhang J, Xiao X, Hong X, Lai Y (2017) Investigation of the conductive network formation of polypropylene/graphene nanoplatelets composites for different platelet sizes. J Mater Sci 52:13103–13119. https://doi.org/10.1007/s10853-017-1413-y

    Article  Google Scholar 

  28. Amoli BM, Hu A, Zhou NY, Zhao B (2015) Recent progresses on hybrid micro–nano filler systems for electrically conductive adhesives (ECAs) applications. J Mater Sci: Mater Electron 26:4730–4745

    Google Scholar 

  29. Taherian R (2016) Experimental and analytical model for the electrical conductivity of polymer-based nanocomposites. Compos Sci Technol 123:17–31

    Article  Google Scholar 

  30. Zhai L, Li G, Xu Y, Xiao M, Wang S, Meng Y (2015) Poly(propylene carbonate)/aluminum flake composite films with enhanced gas barrier properties. J Appl Polym Sci 132:41663

    Google Scholar 

  31. An FZ, Wang ZW, Hu J, Gao XQ, Shen KZ, Deng C (2014) Morphology control technologies of polymeric materials during processing. Macromol Mater Eng 299:400–423

    Article  Google Scholar 

  32. Tobjörk D, Österbacka R (2011) Paper electronics. Adv Mater 23:1935–1961

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by the Foundation of the Key Laboratory of Low-Carbon Chemistry and Energy Conservation of Guangdong Province, the Fundamental Research Funds for the Central Universities (No. 17lgpy69), and the Guangxi Natural Science Foundation (No. 2016GXNSFDA380024).

Author information

Authors and Affiliations

  1. School of Chemical Engineering and Technology, Sun Yat-sen University, Zhuhai, 519082, China

    Zuomin Lei, Zhenxing Chen, Huan Peng, Yuqiu Shen, Wenchao Feng, Yi Liu, Zhuo Zhang & Yan Chen

  2. The Key Laboratory of Low-Carbon Chemistry and Energy Conservation of Guangdong Province, Sun Yat-sen University, Guangzhou, 510275, China

    Zhenxing Chen

  3. School of Materials Science and Engineering, Baise University, Baise, 533000, China

    Zhenxing Chen

Authors
  1. Zuomin Lei
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhenxing Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Huan Peng
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yuqiu Shen
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Wenchao Feng
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Yi Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  7. Zhuo Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  8. Yan Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Zhenxing Chen.

Electronic supplementary material

Below is the link to the electronic supplementary material.

Supplementary material 1 (DOCX 22 kb)

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lei, Z., Chen, Z., Peng, H. et al. Fabrication of highly electrical conductive composite filaments for 3D-printing circuits. J Mater Sci 53, 14495–14505 (2018). https://doi.org/10.1007/s10853-018-2645-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-018-2645-1

Keywords

Search

Navigation