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Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy

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Abstract

Considering non-equilibrium solidification and its influence on subsequent near-equilibrium solidification together, the description of recalescence behavior in bulk undercooled Cu70Ni30 alloy was adopted to predict the corresponding microstructure transition. The thermal plateau time for near-equilibrium solidification can be deduced directly with the calculation of non-equilibrium solid fraction formed in recalescence. On the basis of quantitative description for recalescence behavior, the non-equilibrium solid fraction, residual liquid fraction, dendrite broken-up time, and thermal plateau time can be determined as functions of initial undercooling. Then, a simple and accurate application of dendrite fragmentation model was performed as the grain refinement at both low- and high-undercooling originates from dendrite breakup. The predicted undercooling regions for the double grain refinement agree well with the experimental observation. Moreover, the change of grain morphology for the second grain refinement can be ascribed to the occurrence of recrystallization produced by the enhanced residual stress upon highly undercooled solidification.

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Acknowledgements

W. Yang is grateful to the financial support by the fund of the State Key Laboratory of Solidification Processing in NWPU (SKLSP201118) and Scientific Starting Foundation for Doctorate Research in Nanchang Hangkong University (EA201003234). The authors are also grateful to the Free Research Fund of State Key Lab. of Solidification Processing (09-QZ-2008; 24-TZ-2009), the 111 project (B08040), the Natural Science Foundation of China (Grant nos. 50771084; 51071127, 50901059), National Basic Research Program of China (973 Program) 2011CB610403, the HuoYingdong Yong Teacher Fund (111052), the Fundamental Research Fund of Northwestern Polytechnical University (2008JC01), Aeronautical Science Foundation of China (2008ZF56016), the Open Fund of Aeronautical Science and Technology Key Lab. of Aeronautical Materials Processing in Nanchang Hangkong University and the Project of Education Department of Jiangxi (GJJ08199).

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Authors and Affiliations

  1. National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, Nanchang, 330063, People’s Republic of China

    W. Yang, Z. F. Xu & B. P. Lu

  2. State Key Laboratory of Solidification Processing, Northwestern Polytechnical University, Xi’an, 710072, Shaanxi, People’s Republic of China

    F. Liu & G. C. Yang

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  1. W. Yang
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  2. F. Liu
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  3. Z. F. Xu
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  4. B. P. Lu
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  5. G. C. Yang
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Correspondence to W. Yang.

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Yang, W., Liu, F., Xu, Z.F. et al. Use of recalescence behavior analysis for the prediction of grain refinement in undercooled Cu–Ni alloy. J Mater Sci 46, 3101–3107 (2011). https://doi.org/10.1007/s10853-010-5189-6

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  • DOI: https://doi.org/10.1007/s10853-010-5189-6

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