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TEM observation of liquid-phase bonded aluminum–silicon/aluminum nitride hetero interface

  • IIB 2010
  • Published:
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Abstract

Liquid-phase bonded aluminum–silicon/aluminum nitride interface structure was investigated using high-resolution transmission electron microscopy. A textured layer of aluminum formed a stable orientation relationship with aluminum nitride, which showed Al(111) to be tilted by about 4° with respect to the AlN(0001) interface plane. The unique orientation relationship between Al and AlN was predicted as one of the stable orientation relationships using coincidence of reciprocal lattice point method, which surveys the degree of geometrical coherency between two crystals in three-dimensional space. A stable orientation relationship was found to be (001)[1\( \bar{1} \)0]Al//(2\( \bar{2} \)03)[11\( \bar{2} \)0]AlN.

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Acknowledgements

A part of this work was conducted in the Center for Nano Lithography & Analysis, The University of Tokyo, supported by the Ministry of Education, Culture, Sports, Science and Technology (MEXT), Japan. N.S. acknowledges supports from PRESTO, Japan Science and Technology Agency and Grant-in-Aid for Young Scientists (A) (20686042) from MEXT. The authors are thankful to the support of Dr. Yoshirou Kuromitsu and Mr. Kazuhiro Akiyama of Mitsubishi Materials Corporation for the fabrication of the liquid-phase bonded samples and for the technical discussions.

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Authors and Affiliations

  1. Institute of Engineering Innovation, The University of Tokyo, Tokyo, 113-8656, Japan

    Christine Marie Montesa, Naoya Shibata, Tetsuya Tohei & Yuichi Ikuhara

  2. PRESTO, Japan Science and Technology Agency, Saitama, 332-0012, Japan

    Naoya Shibata

Authors
  1. Christine Marie Montesa
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  2. Naoya Shibata
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  3. Tetsuya Tohei
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  4. Yuichi Ikuhara
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Correspondence to Yuichi Ikuhara.

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Montesa, C.M., Shibata, N., Tohei, T. et al. TEM observation of liquid-phase bonded aluminum–silicon/aluminum nitride hetero interface. J Mater Sci 46, 4392–4396 (2011). https://doi.org/10.1007/s10853-010-5023-1

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  • DOI: https://doi.org/10.1007/s10853-010-5023-1

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