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Effect of thermal residual stresses on the strength for both alumina/Ni/alumina and alumina/Ni/nickel alloy bimaterials

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Abstract

This paper describes some technical limitations encountered in joining ceramics–ceramics or ceramics–metals, and how, to some extent, they have been practically overcome. The effect of the residual stresses on the strength of joints fabricated between alumina–alumina or alumina and the nickel base alloy HAYNES® 214™ using a solid-state bonding technique with Ni interlayer was studied. Finite element analyses (FEA) for the elastic–plastic and elastic–plastic–creep behavior have also been used to better design the joints and to predict their performance. It was found that the residual stresses caused by the thermal expansion mismatch between alumina (Al2O3) and the Ni-based superalloy (HAYNES® 214™) have severely deteriorated the joints compared to Al2O3–Al2O3 joint fabricated with the same solid-state bonding parameters. The high residual stresses zones obtained through the FEA simulation fitted well with the fractographic observations of the Al2O3/Ni/HAYNES® 214™ joints. Also, in order to use the joint material as a structural material, the study about the effect of geometrical parameters has been performed. Optimal geometries have been determined.

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Authors and Affiliations

  1. Laboratoire de Tribologie et Dynamique des Systèmes, UMR CNRS ECL ENISE ENSMSE 5513, École Centrale de Lyon, Lyon, France

    M. L. Hattali, S. Valette & D. Tréheux

  2. Laboratoire de Sciences et Génie des Matériaux, École Nationale Polytechnique d’Alger, 10, Avenue de Hassen Badi EL Harrach, Alger, Algeria

    N. Mesrati

  3. Institut Français du Pétrole, Lyon, France

    F. Ropital

Authors
  1. M. L. Hattali
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  2. S. Valette
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  3. F. Ropital
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  4. N. Mesrati
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  5. D. Tréheux
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Correspondence to M. L. Hattali.

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Hattali, M.L., Valette, S., Ropital, F. et al. Effect of thermal residual stresses on the strength for both alumina/Ni/alumina and alumina/Ni/nickel alloy bimaterials. J Mater Sci 44, 3198–3210 (2009). https://doi.org/10.1007/s10853-009-3426-7

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  • DOI: https://doi.org/10.1007/s10853-009-3426-7

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