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Fabrication of nanosized metallic copper by electrochemical milling process

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Abstract

Using a copper oxide powder of micrometer size as the starting electrode material in CuO/Li cells, copper oxide (CuO) can be electrochemically reduced into metal particles of smaller sizes in a controllable way. A novel electrochemical milling (ECM) method is developed for a “top–down” synthesis of nanometer-scaled metal particles. X-ray diffraction (XRD), field-emission scanning electron microscopy (FESEM), and transmission electron microscopy (TEM) were employed to characterize the structure of copper particles obtained by the electrochemical reduction. The influences of CuO precursors, current density, and operating temperature on the final products were also studied. It is found that the latter two factors had pronounced effects on the obtained copper products.

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References

  1. Zhang Z, Sun X, Dresselhaus MS, Ying JY (2000) Phys Rev B 61:4850

    Article  CAS  Google Scholar 

  2. Wang ZL (2000) Adv Mater 12:1295

    Article  CAS  Google Scholar 

  3. Sun L, Searson PC, Chien CL (2001) Appl Phys Lett 79:4429

    Article  CAS  Google Scholar 

  4. Cui Y, Wei Q, Park H, Lieber CM (2001) Science 293:1298

    Article  Google Scholar 

  5. Monson CF, Woolley AT (2003) Nano Lett 3:359

    Article  CAS  Google Scholar 

  6. Yen MY, Chiu CW, Hsia CH, Chen FR, Kai JJ, Lee CY, Chiu HT (2003) Adv Mater 15:235

    Article  CAS  Google Scholar 

  7. Tanori J, Pileni MP (1997) Langmuir 13:639

    Article  CAS  Google Scholar 

  8. Ziegler KJ, Harrington PA, Ryan KM, Crowley T, Holmes JD, Morris MA (2003) J Phys: Condens Mat 15:8303

    CAS  Google Scholar 

  9. Wang JW, Li YD (2003) Adv Mater 15:445

    Article  CAS  Google Scholar 

  10. Motoyama M, Fukunaka Y, Sakka T, Ogata YH, Kikuchi S (2005) J Electroanal Chem 584:84

    Article  CAS  Google Scholar 

  11. Gao T, Meng GW, Wang YW, Sun SH, Zhang LD (2002) J Phys: Condens Mat 14:355

    CAS  Google Scholar 

  12. Zhang MZ, Wang Y, Yu GW, Wang M, Peng RW, Weng YY, Ming NB (2004) J Phys: Condens Mat 16:695

    CAS  Google Scholar 

  13. Molares MET, Buschmann V, Dobrev D, Neumann R, Scholz R, Schuchert IU, Vetter J (2001) Adv Mater 13:62

    Article  CAS  Google Scholar 

  14. Lisiecki I, Filankembo A, Sack-Kongeh H, Eeiss K, Pileni MP, Urban J (2000) Phys Rev B 61:4968

    Article  CAS  Google Scholar 

  15. Liu ZP, Yang Y, Liang JB, Hu ZK, Li S, Peng S, Qian YT (2003) J Phys Chem B 107:12658

    Article  CAS  Google Scholar 

  16. Chang YH, Wang HW, Chiu CW, Cheng DS, Yen MY, Chiu HT (2002) Chem Mater 14:4334

    Article  CAS  Google Scholar 

  17. Han WK, Choi JW, Hwang GH, Hong SJ, Lee JS, Kang SG (2006) Appl Surf Sci 252:2832

    Article  CAS  Google Scholar 

  18. Li CM, Lei H, Tang YJ, Luo JS, Liu W, Chen ZM (2004) Nanotechnology 15:1866

    Article  CAS  Google Scholar 

  19. Wang PI, Zhao YP, Wang GC, Lu TM (2004) Nanotechnology 15:218

    Article  CAS  Google Scholar 

  20. Poizot P, Laruelle S, Grugeon S, Dupont L, Tarascon JM (2000) Nature 407:496

    Article  CAS  Google Scholar 

  21. Grugeon S, Laruelle S, Urbina HR, Dupont L, Poizot P, Tarascon JM (2001) J Electrochem Soc 148:A285

    Article  CAS  Google Scholar 

  22. Debart A, Dupont L, Poizot P, Leriche JB, Tarascon JM (2001) J Electrochem Soc 148:A1266

    Article  CAS  Google Scholar 

  23. Gao XP, Bao JL, Pan GL, Zhu HY, Huang PX, Wu F, Song DY (2004) J Phys Chem B 108:5547

    Article  CAS  Google Scholar 

  24. Zhang DW, Chen CH, Zhang J, Ren F (2005) Chem Mater 17:5242

    Article  CAS  Google Scholar 

  25. Yu Y, Chen CH, Shui JL, Xie S (2005) Angew Chem Int Ed 44:7085

    Article  CAS  Google Scholar 

  26. Hu YS, Guo YG, Sigle W, Hore S, Balaya P, Maier J (2006) Nat Mater 5: 713

    Article  CAS  Google Scholar 

  27. Burbank J (1966) J Electrochem Soc 113:10

    Article  CAS  Google Scholar 

  28. Novak P (1985) Electrochim Acta 30: 1687

    Article  CAS  Google Scholar 

  29. Zhang DW, Yi TH, Chen CH (2005) Nanotechnology 16:2338

    Article  CAS  Google Scholar 

  30. Morcrette M, Rozier P, Dupont L, Mugnier E, Sannier L, Galy J, Tarascon JM (2003) Nat Mater 2:755

    Article  CAS  Google Scholar 

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Acknowledgements

This study was supported by National Science Foundation of China (Grant No. 20703013 and 20471057). We are also grateful to The Ministry of Education (SRFDP No. 2003035057) and the PD Foundation of China (Grant No. 20070410218).

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Correspondence to Da-Wei Zhang.

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Zhang, DW., Chen, CH., Zhang, J. et al. Fabrication of nanosized metallic copper by electrochemical milling process. J Mater Sci 43, 1492–1496 (2008). https://doi.org/10.1007/s10853-007-2274-6

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  • DOI: https://doi.org/10.1007/s10853-007-2274-6

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