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Application of Contactless Testing to PCBs with BGAs and Open Sockets

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Abstract

This paper introduces a practical test method that combines statistics with a contactless test approach. Experiments using real PCBs show the effectiveness of the method, where significant z-scores are obtained to discriminate defective interconnects. The studied test cases involve conventional Printed Circuit Boards (PCBs) with Ball Grid Array (BGA) packages and open sockets.

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Acknowledgment

The authors acknowledge the ESIS project which is supported by EU structural funds for financing this work.

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Authors and Affiliations

  1. Department of Computer Science, Electrical, Space Engineering, Luleå University of Technology, Luleå, Sweden

    Abdelghani Renbi & Jerker Delsing

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  1. Abdelghani Renbi
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  2. Jerker Delsing
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Correspondence to Abdelghani Renbi.

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Responsible Editor: E. J. Marinissen

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Renbi, A., Delsing, J. Application of Contactless Testing to PCBs with BGAs and Open Sockets. J Electron Test 31, 339–347 (2015). https://doi.org/10.1007/s10836-015-5535-3

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  • DOI: https://doi.org/10.1007/s10836-015-5535-3

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