Skip to main content
SpringerLink
Log in

Effect of cerium chloride on electric crystallization behavior and grain refinement of electrodeposited copper

  • Research Article
  • Published:
Journal of Applied Electrochemistry Aims and scope Submit manuscript

Abstract

Rare earth additives have an important influence on the quality of the deposited layer and the electric crystallization behavior during metal electrodeposition. In this paper, linear scanning voltammetry (LSV), cyclic voltammetry (CV), and chronoamperometry (CA) were used to investigate the effects of different concentrations (0 –1.0 g·L−1) of cerium chloride additives on the electric crystallization behavior of copper electrodeposited by industrial electrolytes. The microscopic morphology, grain size, and preferred orientation of copper deposition layers obtained from Harlem tank experiments were analyzed by scanning electron microscopy and X-ray diffraction to investigate the effect of cerium chloride on the grain refinement and crystal growth orientation of copper deposition layers in industrial electrolysis. The results show that: When cerium chloride was added into industrial electrolyte, the copper deposition potential shifted negatively, the cathode polarization increased, the nucleation relaxation time decreased, the nucleation rate of copper increased, and the grain was refined. However, the addition of cerium chloride did not change the nucleation/growth mechanism of copper, which is still three-dimensional instantaneous nucleation. When the concentration of cerium chloride is 0.4 g·L−1, the cathodic polarization was the largest, the nucleation relaxation time was the shortest, and the deposited layer grains were the smallest. Moreover, the preferred orientation of the deposited layer is changed from (220) to (220) and (222) to double preferred, thus suppressing grain growth and uniform grain distribution of the deposited layer. Therefore, 0.4 g·L−1 is the optimum concentration of cerium chloride to be added.

Graphical abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9

Similar content being viewed by others

References

  1. Chiang CH, Lin CC, Hu CC (2021) Effects of Thiourea and Allyl Thioura on the electrodeposition and microstructures of copper from methanesulfonic acid baths. J Electrochem Soc 168(3):032505

    Article  CAS  Google Scholar 

  2. Sekar R (2017) Synergistic effect of additives on electrodeposition of copper from cyanide-free electrolytes and its structural and morphological characteristics. Trans Nonferr Met Soc China 27(7):1665–1676

    Article  CAS  Google Scholar 

  3. Xu YT, Pei L, Yang B et al (2023) Study on the effect of cerium sulfate on grain refinement of copper electrodeposited layers. Chin J Rare Earths. https://doi.org/10.21203/rs.3.rs-3268605/v1

    Article  Google Scholar 

  4. Gabrielli C, Mocoteguy P, Perrot H et al (2004) Mechanism of copper deposition in a sulphate bath containing chlorides. J Electroanal Chem 572(2):367–375

    Article  CAS  Google Scholar 

  5. Shen YF (2022) Raman spectroscopy and electrochemical study on adsorption behavior of nitrogen-containing additives in acidic solution on copper electrode surface [D]. Changzhou University, Changzhou

    Google Scholar 

  6. Fang YC, Pan MX, Huang H et al (2021) Current status and outlook of research on the influence of additives in copper electrolytic deposition process. Min Metall 30(05):61–69

    CAS  Google Scholar 

  7. He XH, Yu ZZ, Luo J (2001) Problems and countermeasures in the production of high purity copper cathodes. Nonferr Met 05:8–10

    Google Scholar 

  8. Tomie M, Akita T, Irita M et al (2020) Transitional additive adsorption with co-addition of suppressor and leveler for copper TSV filling. J Electrochem Soc 167(8):082513

    Article  CAS  Google Scholar 

  9. Wang YN (2021) The refining effect and mechanism of rare earth elements on electrodeposited coatings of nickel in industrial electrolytes. Lanzhou University of Technology, Lanzhou

    Google Scholar 

  10. Wang DZ, Wan Q, Yang YC (1996) Research and development of rare earth advanced materials in China. Chin J Rare Earths 3:223–230

    Google Scholar 

  11. Zhang QB, Hua YX, Xu CY et al (2015) Non-haloaluminate ionic liquids for low-temperature electrodeposition of rare-earth metals a review. J Rare Earths 33:1025

    Article  Google Scholar 

  12. Tang CB (2013) Principles of Metallurgical Electrochemistry [M]. Metallurgical Industry Press, Beijing

    Google Scholar 

  13. He YN, Yuan L, Ding ZY et al (2017) Effect of allylthiourea on nickel electrodeposition from solution containing ammonia and chloride. Electrochemical 23(06):638–644

    Google Scholar 

  14. Li D (2008) Electrochemical principle [M]. Beijing University of Aeronautics and Astronautics Press, Beijing

    Google Scholar 

  15. Xu YT, Wang YN (2021) Research status of effect of rare earth on metal electrodeposition process and properties of deposited layer. Chin J Nonferr Met 31(05):1310–1319

    Google Scholar 

  16. Xu Y, Huang K, Zhu Z (2019) Effect of glassy carbon, gold, and nickel electrodes on nickel electric crystallization in an industrial electrolyte. Surf Coat Technol 370:1–10

    Article  CAS  Google Scholar 

  17. Zhang W (2016) Effect of additives on electric crystallization of nickel in the industrial electrolyte [D]. Lanzhou University of Technology, Lanzhou

    Google Scholar 

  18. Ni J (2017) The influence of Sodium citrate and potassium sodium tartrate compound additives on copper Electrodeposition. Int J Electrochem Sci 12:6874–6884

    Article  CAS  Google Scholar 

  19. Bolzán AE (2013) Electrodeposition of copper on glassy carbon electrodes in the presence of picolinic acid. Electrochim Acta 113:706–718

    Article  Google Scholar 

  20. Xu C, Chen FC, Wu DM et al (2010) Study of electrodeposition behavior of nickel-iron-tungsten alloy. Surf Technol 39(05):26–29

    CAS  Google Scholar 

  21. Li CQ, Li XH, Wang ZX et al (2015) Mechanism of nickel electric crystallization in sodium citrate solution. J Cent South Univ 46(08):2797–2803

    CAS  Google Scholar 

  22. Ai A, Lfk B, Ald A et al (2021) Tuning grain size, morphology, hardness and magnetic property of electrodeposited nickel with a single multifunctional additive. Mater Chem Phys 267:124681

    Article  Google Scholar 

  23. Scharifker B, Hills G (1983) Theoretical and experimental studies of multiple nucleation. Electrochim Acta 28(7):879–889

    Article  CAS  Google Scholar 

  24. He T, Yi GB, Cai FM et al (2010) Effect of RE addition on the organization and properties of electrolytic copper foil. Special Cast Nonferr Alloys 30(07):658–660

    CAS  Google Scholar 

  25. Zhu MH, Li LQ (2006) Research progress on the application of rare earth additives in metal electrodeposition. Plat Finish 06:46–48

    Google Scholar 

  26. Jiang JX, Wen YQ (2021) The role and application of rare earths in copper and copper alloys. Rare Earth Inf 05:12–18

    CAS  Google Scholar 

  27. Cai FM (2011) The influence of electro-deposition parameters on microstructure and mechanical properties of electrolytic copper foil [D]. Nanchang University, Nanchang

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou, 730050, China

    Xu Yang-tao, Du Hai-yang, Pei Liang, Dai Jin-ming & Peng Yin

  2. Baiyin Novel Materials Research Institute, Lanzhou University of Technology, Baiyin, 730900, China

    Xu Yang-tao

Authors
  1. Xu Yang-tao
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Du Hai-yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Pei Liang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Dai Jin-ming
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Peng Yin
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

XY is mainly responsible review and revision of manuscript and provides theoretical and technical guidance. DH is mainly responsible for manuscript writing and data processing. PL, DJ and PY are mainly responsible for photo finishing and manuscript layout.

Corresponding author

Correspondence to Xu Yang-tao.

Ethics declarations

Competing interests

The authors declare no competing interests.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yang-tao, X., Hai-yang, D., Liang, P. et al. Effect of cerium chloride on electric crystallization behavior and grain refinement of electrodeposited copper. J Appl Electrochem 54, 597–609 (2024). https://doi.org/10.1007/s10800-023-01984-y

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10800-023-01984-y

Keywords

Search

Navigation