Skip to main content
Log in

Effects of four N-based additives on imitation gold plating

  • Research Article
  • Published:
Journal of Applied Electrochemistry Aims and scope Submit manuscript

Abstract

In this work, it investigated a non-cyanide imitation gold plating system, namely a hydroxyethylidene diphosphonic acid system. The bath in this system is less toxic and less expensive, and the decorative quality of the coating can be maintained with this system. The effects of four N-based additives, namely triethanolamine (TEA), ammonium fluoride (AF), ammonia triacetic acid (NTA), and polyacrylamide (PAM), on the performance of the Cu–Zn–Sn alloy coating were studied. The results indicate that TEA can be used as an auxiliary complexing agent to promote anodic dissolution, improve the dispersibility of the bath, and control the colour and brightness of the coating. The carboxylic acid group of NTA is easily discharged in the cathode, inducing the hydrogen evolution reaction, which results in a blackened and irregular coating surface. In addition to inorganic amines, AF also contains fluoride ions, which enable the formation of uniformly sized particles, dense crystals, and a compactly arranged coating, and may promote the formation of a yellow coating. The long chain of PAM prevents the migration of Cu2+ ions in the solution, which causes a decrease in the anodic stripping peak current and thus adversely affects the electrode interface. The mechanism of the four additives in the electroplating process was studied, and the results may provide theoretical guidance for selecting additives for the Cu–Zn–Sn electroplating process.

Graphical Abstract

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6

Similar content being viewed by others

References

  1. Oliveira GMD, Barbosa LL, Broggi RL, Carlos IA (2005) Voltammetric study of the influence of EDTA on the silver electrodeposition and morphological and structural characterization of silver films. J Electroanal Chem 578:151–158

    Article  Google Scholar 

  2. Yang SC, Ho CE, Chang CW, Kao CR (2011) Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu. J Mater Res 21:2436–2439

    Article  Google Scholar 

  3. Jung SB (2006) Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder. J Mater Res 21:1590–1599

    Article  Google Scholar 

  4. Lee JE, Kim KS, Suganuma K, Takenaka J, Hagio K (2005) Interfacial properties of Zn-Sn alloys as high temperature lead-free solder on Cu substrate. Mater Trans 46:2413–2418

    Article  CAS  Google Scholar 

  5. Date M, Tu KN, Shoji T, Fujiyoshi M, Sato K (2004) Interfacial reactions and impact reliability of Sn Zn solder joints on Cu or electroless Au/Ni(P) bond-pads. J Mater Res 19:2887–2896

    Article  CAS  Google Scholar 

  6. Kim YJ, Jo EJ, Kamble AS, Gang MG, Kim JH, Moon JH (2017) Improving the solar cell performance of electrodeposited Cu2ZnSn(S,Se)4 by varying the Cu/(Zn + Sn) ratio. Solar Energy 145:13–19

    Article  CAS  Google Scholar 

  7. Oliveira GMD, Carlos IA (2009) Silver–zinc electrodeposition from a thiourea solution with added EDTA or HEDTA. Electrochim Acta 54:2155–2163

    Article  Google Scholar 

  8. Domínguez-Ríos C, Moreno MV, Torres-Sánchez R, Antúnez W, Aguilar-Elguézabal A, González-Hernández J (2008) Effect of tartrate salt concentration on the morphological characteristics and composition of Cu-Zn electroless plating on zamak 5 zinc alloy. Surf Coat Technol 202:4848–4854

    Article  Google Scholar 

  9. Clauwaert K, Binnemans K, Matthijs E, Fransaer J (2016) Electrochemical studies of the electrodeposition of copper-zinc-tin alloys from pyrophosphate electrolytes followed by selenization for CZTSe photovoltaic cells. Electrochim Acta 188:344–355

    Article  CAS  Google Scholar 

  10. Pecequilo CV, Panossian Z (2010) Study of copper electrodeposition mechanism from a strike alkaline bath prepared with 1-hydroxyethane-1,1-diphosphonic acid through cyclic voltammetry technique. Electrochim Acta 55:3870–3875

    Article  CAS  Google Scholar 

  11. Juškėnas R, Karpavičienė V, Pakštas V, Selskis A, Kapočius V (2007) Electrochemical and XRD studies of Cu–Zn coatings electrodeposited in solution with d-mannitol. J Electroanal Chem 602:237–244

    Article  Google Scholar 

  12. Carlos IA, Almeida MRHD. (2004) Study of the influence of the polyalcohol sorbitol on the electrodeposition of copper–zinc films from a non-cyanide bath. J Electroanal Chem 562:153–159

    Article  CAS  Google Scholar 

  13. Ibrahim MAM, Bakdash RS (2015) New non-cyanide acidic copper electroplating bath based on glutamate complexing agent. Surf Coat Technol 282:139–148

    Article  CAS  Google Scholar 

  14. Slupska M, Ozga P (2014) Electrodeposition of Sn-Zn-Cu alloys from citrate solutions. Electrochim Acta 141:149–160

    Article  CAS  Google Scholar 

  15. Almeida MRHD., Barbano EP, Carvalho MFD, Carlos IA, Siqueira JLP, Barbosa LL (2011) Electrodeposition of copper–zinc from an alkaline bath based on EDTA. Surf Coat Technol 206:95–102

    Article  Google Scholar 

  16. Broggi RL, Oliveira GMD, Barbosa LL, Pallone EMJA., Carlos IA (2006) Study of an alkaline bath for tin deposition in the presence of sorbitol and physical and morphological characterization of tin film. J Appl Electrochem 36:403–409

    Article  CAS  Google Scholar 

  17. Carvalho MFD, Barbano EP, Carlos IA (2015) Electrodeposition of copper-tin-zinc ternary alloys from disodium ethylenediaminetetraacetate bath. Surf Coat Technol 262:111–122

    Article  Google Scholar 

  18. Carvalho MFD, Barbano EP, Carlos IA (2013) Influence of disodium ethylenediaminetetraacetate on zinc electrodeposition process and on the morphology, chemical composition and structure of the electrodeposits. Electrochim Acta 109:798–808

    Article  Google Scholar 

  19. El-Chiekh F, El-Haty MT, Minoura H, Montaser AA (2015) Electrodeposition and characterization of Cu–Ni–Zn and Cu–Ni–Cd alloys. Electrochim Acta 50:2857–2864

    Article  Google Scholar 

  20. Long JM, Zhang X, Pei HZ (2013) Effect of triethanolamine addition in alkaline bath on the electroplating behavior, composition and corrosion resistance of Zn-Ni alloy coatings. Adv Mater Res 738:87–91

    Article  CAS  Google Scholar 

  21. Jung M, Lee G, Choi J (2017) Electrochemical plating of Cu-Sn alloy in non-cyanide solution to substitute for Ni undercoating layer. Electrochim Acta 241:229–236

    Article  CAS  Google Scholar 

  22. Senna LF, Díaz SL, Sathler L (2003) Electrodeposition of copper–zinc alloys in pyrophosphate-based electrolytes. J Appl Electrochem 33:1155–1161

    Article  CAS  Google Scholar 

  23. Silva FLG, Lago DCBD., D’Elia E, Senna LF (2010) Electrodeposition of Cu–Zn alloy coatings from citrate baths containing benzotriazole and cysteine as additives. J Appl Electrochem 40:2013–2022

    Article  CAS  Google Scholar 

  24. Chai YC, Truscello S, Van BS, Luyten FP, Vleugels J, Schrooten J (2011) Perfusion electrodeposition of calcium phosphate on additive manufactured titanium scaffolds for bone engineering. Acta Biomater 7:2310–2319

    Article  CAS  Google Scholar 

  25. Darban AK, Aazami M, Meléndez AM, Abdollahy M, Gonzalez I (2011) Electrochemical study of orpiment (As2S3) dissolution in a NaOH solution. Hydrometallurgy 105:296–303

    Article  CAS  Google Scholar 

  26. Barbano EP, Carvalho MFD, Carlos IA (2016) Electrodeposition and characterization of binary Fe-Mo alloys from trisodium nitrilotriacetate bath. J Electroanal Chem 775:146–156

    Article  CAS  Google Scholar 

  27. Carvalho MFD, Brito MMD, Carlos IA (2016) Study of the influence of the trisodium nitrilotriacetic as a complexing agent on the copper, tin and zinc co-deposition, morphology, chemical composition and structure of electrodeposits. J Electroanal Chem 763:81–89

    Article  Google Scholar 

  28. Ramírez C, Calderón JA (2016) Study of the effect of triethanolamine as a chelating agent in the simultaneous electrodeposition of copper and zinc from non-cyanide electrolytes. J Electroanal Chem 765:132–139

    Article  Google Scholar 

  29. Li QY, Ge W, Yang PX, Zhang JQ, An MZ (2016) Insight into the role and its mechanism of polyacrylamide as an additive in sulfate electrolytes for nanocrystalline zinc electrodeposition. J Electrochem Soc 163:D127-D132

    Google Scholar 

  30. Fabian CP, Ridd MJ, Sheehan ME (2007) Assessment of activated polyacrylamide and guar as organic additives in copper electrodeposition. Hydrometallurgy 86:44–55

    Article  CAS  Google Scholar 

  31. Ballesteros JC, Díaz-Arista P, Meas Y, Ortega R, Trejo G (2007) Zinc electrodeposition in the presence of polyethylene glycol 20000. Electrochim Acta 52:3686–3696

    Article  CAS  Google Scholar 

  32. Khelladi MR, Mentar L, Azizi A, Kadirgan F, Schmerber G, Nucleation AD (2012) Growth and properties of Co nanostructures electrodeposited on n-Si (1 1 1). Appl Surf Sci 258:3907–3912

    Article  CAS  Google Scholar 

  33. Ribeaucourt L, Savidand GD. Lincot E, Chassaing (2011) Electrochemical study of one-step electrodeposition of copper–indium–gallium alloys in acidic conditions as precursor layers for Cu(In,Ga)Se2, thin film solar cells. Electrochim Acta 56:6628–6637

    Article  CAS  Google Scholar 

  34. Wibowo RA, Hamid R, Maier T, Dimopoulos T (2015) Galvanostatically-electrodeposited Cu–Zn–Sn multilayers as precursors for crystallising kesterite Cu2ZnSnS4 Thin Films. Thin Solid Films 582:239–244

    Article  CAS  Google Scholar 

  35. Joint Committee on Powder Diffraction Standards, JCPDS (2000), Powder Diffraction File - PDF-2, Database Sets 1–49. ICDD, Pennsylvania, (CDROM)

  36. He X, Shen H, Wang W, Pi J, Hao Y, Shi X (2013) Synthesis of Cu2ZnSnS4 films from co-electrodeposited Cu–Zn–Sn precursors and their microstructural and optical properties. Appl Surf Sci 282:765–769

    Article  CAS  Google Scholar 

  37. Wang H, Hreid T, Li J, Zhang Y, Spratt H (2015) Effects of metal ion concentration on electrodeposited CuZnSn film and its application in kesterite Cu2ZnSnS4 solar cells. RSC Adv 5:65114–65122

    Article  Google Scholar 

  38. Hreid T, O’Mullane AP, Spratt HJ, Will G, Wang H (2016) Investigation of the electrochemical growth of a Cu–Zn–Sn film on a molybdenum substrate using a citrate solution. J Appl Electrochem 46:1–10

    Article  Google Scholar 

  39. Zhang YZ, Liao C, Zong K, Wang H, Liu JB, Jiang T, Han JF, Liu GQ, Cui L, Ye QY, Yan H, Lau WM (2013) Cu2ZnSnSe4 thin film solar cells prepared by rapid thermal annealing of Co-electroplated Cu-Zn-Sn precursors. Sol Energy 94:1–7

    Article  CAS  Google Scholar 

  40. Elbeyli İY (2015) Production of crystalline boric acid and sodium citrate from borax decahydrate. Hydrometallurgy 158:19–26

    Article  CAS  Google Scholar 

  41. Alexandratos SD (2015) The modification of hydroxyapatite with ion-selective complexants: 1-hydroxyethane-1,1-diphosphonic acid. Ind Eng Chem Res 54:585–596

    Article  Google Scholar 

Download references

Acknowledgements

This work was supported by the National Natural Science Foundation of China (NSFC51604180), the Applied Basic Research Programs of Science and Technology Department of Shanxi Province (201701D221036), the start-up funds of Taiyuan Institute of Technology, and the Youth Academic Leader of Taiyuan Institute of Technology support program.

Author information

Authors and Affiliations

Authors

Corresponding author

Correspondence to Lifeng Ding.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Ding, L., Liu, F., Cheng, J. et al. Effects of four N-based additives on imitation gold plating. J Appl Electrochem 48, 175–185 (2018). https://doi.org/10.1007/s10800-018-1148-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10800-018-1148-8

Keywords

Navigation