Abstract
The normal conducting electron-positron Linear Collider projects imply that accelerating structures and other RF components will undergo an action of extremely high RF fields. Except for the RF breakdown threat, there is an effect of the copper surface being damage due to multi-pulse mechanical stress caused by Ohmic losses in the skin layer.
In this paper we would like to introduce a new “grain” model of the processes responsible for the fatigue of the metal surface. This model is based on the quasi-elastic interaction between neighboring grains in the metal due to the thermal expansion of the skin layer. This mechanism of fatigue is compared with another, where stresses are generated by the temperature gradient towards the bulk of the material. With the proposed formalism one can estimate the total number of the RF pulses required to fracture the surface depending on the temperature rise, pulse length and steady state temperature. The parameters necessary to finalize the proposed approach were found through the comparison of experimental data obtained at 11.424 GHz.
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References
V. F Kovalenko. Physics of Heat Transfer and Electrovacuum Devices. Sovetskoe Radio, Moscow, 1975. (In Russian).
O. A. Nezhevenko, On the Limitation of Accelerating Gradient in Linear Colliders Due to the Pulse Heating, PAC97, Vancouver, 1997, p. 3013.
V. R. Regel’, A. I. Slutsker and É. E. Tomashevskiĭ, The Kinetic Nature of the Strength of Solids. Sov. Phys. Uspekhi. 15(1), 45–65 (1972) (in Russian).
D. P. Pritzkau et al. Experimental Study of RF Pulsed Heating on Oxygen Free Electronic Copper, Physical Review Special Topics – Accelerators and Beams, Vol. 5, 2002, pp. 112002–1 – 112002–21.
S. V. Kuzikov et al. Experiment to Study Effects of Multi-Pulse Heating in a 30 GHz Resonant Cavity, Proc. of the Strong Microwaves in Plasmas Conf., Vol. 1, 2003, pp. 195–198.
S. Kuzikov et al. Studies of Thermal Fatigue Caused by RF Pulse Heating. Proceedings of EPAC, Edinburgh, Scotland, 2006, pp. 1343–1345.
S. T. Heikkinen, S. Calatroni, H. Neupert. Thermal Fatigue in High Gradient Particle Accelerators. CLIC Note 648. Geneva, Switzerland, 2006.
V. Y. Gertsman, M. Hoffmann, H. Gleiter, R. Birringer. The study of grain size dependence of yield stress of copper for a wide grain size range. Acta metallurgica et materialia. 1994, vol. 42, no10, pp. 3539–3544.
I. Syratchev, private communication.
Acknowledgment
The authors would like to express their acknowledgments to Igor Syratchev and Alexander Fiks for the inspiration of these studies and many useful discussions. The authors thank Jenny Syratchev for her help in editing this paper and preparation for publication.
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Kuzikov, S.V., Plotkin, M.E. Theory of Thermal Fatigue Caused by RF Pulsed Heating. Int J Infrared Milli Waves 29, 298–311 (2008). https://doi.org/10.1007/s10762-007-9319-4
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DOI: https://doi.org/10.1007/s10762-007-9319-4