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Syntact Heat-Insulating Materials Based on Ceramic-Forming Organosilicon Binder

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Abstract

The possibility of using hollow ceramic microspheres and an organosilicon binder with silane and carbosilane links to obtain heat-resistant heat-insulating foam ceramics for construction purposes is demonstrated. The effect of the filler and the gaseous medium on the products of thermal destruction and the properties of the composite is considered. The thermophysical and physicomechanical characteristics of the heat-insulating materials are specified.

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REFERENCES

  1. V. Yu. Chukhlanov and E. P. Sysoev, “Use of hollow microspheres in organosilicon syntact foam materials, ” Steklo Keram., No. 2, 11–12 (2000).

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  3. V. Yu. Chukhlanov and A. N. Alekseenko, “Use of syntact foam plastics with organosilicon binders in construction,” Stroit. Mater., No. 6, 26–27 (2001).

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Authors and Affiliations

  1. Vladimir State University, Vladimir, Russia

    V. Yu. Chukhlanov, E. P. Sysoev & E. N. Tereshina

Authors
  1. V. Yu. Chukhlanov
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  2. E. P. Sysoev
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  3. E. N. Tereshina
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Translated from Steklo i Keramika, No. 5, pp. 25 – 26, May, 2005.

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Chukhlanov, V.Y., Sysoev, E.P. & Tereshina, E.N. Syntact Heat-Insulating Materials Based on Ceramic-Forming Organosilicon Binder. Glass Ceram 62, 145–147 (2005). https://doi.org/10.1007/s10717-005-0058-5

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  • DOI: https://doi.org/10.1007/s10717-005-0058-5

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