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A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications

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Abstract

We present a new double-sided, single-chip monolithic integration scheme to integrate the CMOS circuits and MEMS structures by using through-silicon-via (TSV). Neural sensing applications were chosen as the implementation example. The proposed heterogeneous device integrates standard 0.18 μm CMOS technology, TSV and neural probe array into a compact single chip device. The neural probe array on the back-side of the chip is connected to the CMOS circuits on the front-side of the chip by using low-parasitic TSVs through the chip. Successful fabrication results and detailed characterization demonstrate the feasibility and performance of the neural probe array, TSV and readout circuitry. The fabricated device is 5 × 5 mm2 in area, with 16 channels of 150 μm-in-length neural probe array on the back-side, 200 μm-deep TSV through the chip and CMOS circuits on the front-side. Each channel consists of a 5 × 6 probe array, 3 × 14 TSV array and a differential-difference amplifier (DDA) based analog front-end circuitry with 1.8 V supply, 21.88 μW power consumption, 108 dB CMRR and 2.56 μVrms input referred noise. In-vivo long term implantation demonstrated the feasibility of presented integration scheme after 7 and 58 days of implantation. We expect the conceptual realization can be extended for higher density recording array by using the proposed method.

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Acknowledgments

This work was supported in part by the Ministry of Science and Technology, Taiwan, R.O.C. (under Contract Number:, MOST-103-2220-E-039-001 and MOST-103-2221-E-009-192-MY3), and I-RiCE Program: UST-UCSD International Center of Excellence in Advanced Bioengineering under Grant Number: NSC-102-2911-I-009-101, and Biomedical Electronics Translational Research Center “Aim for the Top University Plan” of the National Chiao Tung University and Ministry of Education, Taiwan, R.O.C. The authors would like to thank National Chip Implementation Center (CIC) and Advanced Semiconductor Engineering Group for chip fabrication and packaging.

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Authors and Affiliations

  1. Department of Bioengineering, University of California in Los Angeles, Los Angeles, CA, 90095, USA

    Chih-Wei Chang

  2. National Chiao Tung University, Hsinchu, 30010, Taiwan

    Lei-Chun Chou, Po-Tsang Huang, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Wei Hwang & Jin-Chern Chiou

  3. Advanced Semiconductor Engineering Group, Kaohsiung, 81170, Taiwan

    Wei Hwang, Kuo-Hua Chen, Chi-Tsung Chiu & Ho-Ming Tong

  4. China Medical University, Taichung, 40402, Taiwan

    Jin-Chern Chiou

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  1. Chih-Wei Chang
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Chang, CW., Chou, LC., Huang, PT. et al. A double-sided, single-chip integration scheme using through-silicon-via for neural sensing applications. Biomed Microdevices 17, 11 (2015). https://doi.org/10.1007/s10544-014-9906-9

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