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A low temperature bonding of quartz microfluidic chip for serum lipoproteins analysis

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Abstract

A low-temperature bonding method for microfabrication of quartz microfluidic chips has been developed. The bonding process involved two steps: pre-bonding and post-annealing at low temperature. The bonding quality was evaluated by measuring the shear force at bonding interface and the electrical properties of the chips. Shear force of 5.66 MPa (566 N/cm2) was obtained in a bonded chip after a post-annealing at 200∘C for 6 h. We owe the strong bonding strength to the formation of Si–O–Si bonds at the bonding interface during the post-annealing stage. The bonding procedures were not sensitive to surrounding and could be performed in a routine laboratory without clean room conditions. The performance of the fabricated microfluidic chips was tested by capillary zone electrophoresis (CZE) of serum lipoproteins with laser-induced fluorescence (LIF). The low-density (LDL) and high-density (HDL) lipoproteins in the serum was separated completely by using tricine buffer with methylglucamine.

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Authors and Affiliations

  1. Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Science, 865 Chang Ning Road, 200050, Shanghai, China

    Guisheng Zhuang, Qinghui Jin, Jing Liu, Kangdong Liu, Jianlong Zhao & Mengsu Yang

  2. Graduate School of the Chinese Academy of Sciences, Beijing, China

    Guisheng Zhuang, Jing Liu & Kangdong Liu

  3. Department of Biology and Chemistry, City University of Hong Kong, Hong Kong, China

    Mengsu Yang

  4. Hospital of Nantong University, Nantong, China

    Hui Cong & Huimin Wang

Authors
  1. Guisheng Zhuang
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  2. Qinghui Jin
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  3. Jing Liu
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  4. Hui Cong
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  5. Kangdong Liu
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  6. Jianlong Zhao
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  7. Mengsu Yang
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  8. Huimin Wang
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Correspondence to Guisheng Zhuang.

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Zhuang, G., Jin, Q., Liu, J. et al. A low temperature bonding of quartz microfluidic chip for serum lipoproteins analysis. Biomed Microdevices 8, 255–261 (2006). https://doi.org/10.1007/s10544-006-9142-z

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  • DOI: https://doi.org/10.1007/s10544-006-9142-z

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