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Study on electrodeposition and corrosion resistance of Cu-Sn alloy prepared in ChCl-EG deep eutectic solvent

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Abstract

The paper presents several experimental results regarding the electrodeposition of Cu-Sn alloy coatings prepared in ChCl-EG deep eutectic solvents (DESs). The electrochemical behavior of Cu2+ and Sn2+ on glassy carbon electrode (GC) was studied by cyclic voltammetry (CV). The nucleation mechanism of Cu2+ and Sn2+ at different potentials was analyzed by the potentiostatic current density transient (chronoamperometry (CA)). Surface and phase composition of Cu-Sn alloy coating were characterized by scanning electron microscopy (SEM/DEX) and X-ray diffraction (XRD). The corrosion resistance of Cu-Sn coating was studied by potentiodynamic polarization (Tafel) and electrochemical impedance spectroscopy (EIS). From the results, it can be seen that the Cu-Sn alloy can be co-deposited at the potential from − 0.5 to − 0.8 V. The surface of the coating showed a different microstructure when the deposition potential changed. With the negative shift of deposition potential (− 0.5 to − 0.8 V), the particle size of the coating decreased. Comparison in the corrosion behavior of the coatings showed that the change of Sn content had an effect on the corrosion resistance of Cu-Sn alloy. The thickness of the coating (from 7 to 11 μm) was obtained by electrodeposition at − 0.8 V (1 h).

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Acknowledgements

We like to express our gratitude to the anonymous reviewers of this paper for their criticisms and suggestions that contributed to improve our work.

Funding

This work was supported by the project of Liaoning Province Shenyang National Laboratory for Materials Science Joint Research (Project 2019JH3/30100021) and Shenyang Ligong University Innovation Team Fund Support.

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Authors and Affiliations

  1. School of Environmental and Chemical Engineering, Shenyang Ligong University, Shenyang, 110168, People’s Republic of China

    Huixuan Qian, Xu Fu, Runjia Zhang, Chunbo Zhan, Haijing Sun, Xin Zhou & Jie Sun

  2. Teaching and Research Department of Modern Science and Technology, Party School of Liaoning Provincial Party Committee, Shenyang, 110004, People’s Republic of China

    Yun Chi

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  1. Huixuan Qian
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  2. Xu Fu
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  7. Xin Zhou
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Correspondence to Jie Sun.

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Qian, H., Fu, X., Chi, Y. et al. Study on electrodeposition and corrosion resistance of Cu-Sn alloy prepared in ChCl-EG deep eutectic solvent. J Solid State Electrochem 26, 469–479 (2022). https://doi.org/10.1007/s10008-021-05086-7

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  • DOI: https://doi.org/10.1007/s10008-021-05086-7

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