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Dynamic analysis on metal selenide electrodeposition

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Abstract

Based on the basic principles of kinetics and some reasonable assumptions about the electrodeposition process, a dynamic model for metal selenide electrodeposition (kink site selected model) was constructed. This model is of universal significance in realizing the compositional prediction and dynamic behavior analysis of deposited films for different main salt concentration ratios and was applied to the ternary Cu–In–Se system. For CuInSe2 electrodeposition, in the Cu–Se system, the co-deposition of Cu and Se can be carried out within a large range of main salt concentration ratio; in the Cu–In system, the mole fraction of Cu in deposited thin films is always higher than that of Cu2+ in electrolyte, while in the In–Se system, the co-deposition of In and Se can be achieved only when the In3+ concentration is much higher than the H2SeO3 concentration. As for the compositional estimation of CuInSe2, the predictive results of our dynamic model agree well with the experimental data. It is then found that by correcting the difference of kink site selectivity constants caused by the change of deposition potential, the error of the predictive results can be reduced.

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Acknowledgments

This work was supported by the National Natural Science Foundation of China (51204214) and China Postdoctoral Science Foundation (2012M511403 and 2013T60777).

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Authors and Affiliations

  1. School of Metallurgy and Environment, Central South University, Changsha, 410083, China

    Fangyang Liu, Can Han, Liangxing Jiang, Jie Li & Yexiang Liu

  2. Engineering Research Centre of Advanced Battery Materials, Ministry of Education, Changsha, 410083, China

    Jie Li

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  1. Fangyang Liu
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  2. Can Han
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  3. Liangxing Jiang
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  4. Jie Li
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Correspondence to Liangxing Jiang or Jie Li.

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Liu, F., Han, C., Jiang, L. et al. Dynamic analysis on metal selenide electrodeposition. J Solid State Electrochem 18, 1833–1845 (2014). https://doi.org/10.1007/s10008-014-2396-0

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  • DOI: https://doi.org/10.1007/s10008-014-2396-0

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