Abstract
A microfabrication process has been developed to elaborate microscale thermoelectric modules with high-aspect-ratio pillars assembled in a glass micromold, whose multi-channels are formed by combining mechanical machining and hot-pressing processes. This paper describes how to fill the multi-channel glass molds with thermoelectric materials by introducing a patterned electrochemical deposition method, in which a deposition cathode with two series of interdigital electrodes is designed. A reverse-pulsed electrodeposition method is found effective to overcome the difficulty for deep-filling that is required for fabricating thermoelectric pillars with high aspect ratios. A pulse circle of −200 mV for 4 s, +500 mV for 1 s, and 0 mV for 3 s (vs. saturated calomel electrode) was determined for preparing N-type Bi2Te3 arrays with a high aspect ratio exceeding ten from a solution containing 0.0075 M Bi3+ and 0.01 M HTeO +2 . The as-deposited pillars show reasonable electrical resistivity as compared with common bulk Bi2Te3 materials.
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References
Rowe DM (1995) CRC handbook of thermoelectrics. CRC, Washington D.C
Snyder GJ, Lim JR, Huang CK, Fleurial JP (2003) Nat Mater 2:528–531
Lim JR, Whitacre JF, Fleurial JP, Huang CK, Ryan MA, Myung NV (2005) Adv Mater 17:1488–1492
Disalvo FJ (1999) Science 285:703–706
Izaki R, Kaiwa N, Hoshino M, Yaginuma T, Yamaguchia S, Yamamoto A (2005) Appl Phys Lett 87:243508–243510
Itoigawa K, Ueno H, Shiozaki M, Toriyama T, Sugiyama S (2005) J Micromech Microeng 15:S233–S238
Goncalves LM, Couto C, Alpuim P, Correia JH (2008) J Micromech Microeng 18:064008–064012
Li JF, Tanaka S, Umeki T, Sugimoto S, Esashi M, Watanabe R (2003) Sens Actuators A 108:97–102
Glatz W, Schwyter E, Durrer L, Hierold C (2009) J Microelectromech Syst 18:763–772
Wang W, Jia FL, Huang QH, Zhang JZ (2005) Microelectron Eng 77:223–229
Poudel B, Hao Q, Ma Y, Lan YC, Minnich A, Yu B, Yan X, Wang DZ, Muto A, Vashaee D, Chen XY, Liu JM, Dresselhaus MS, Chen G, Ren Z (2008) Science 320:634–638
Tittes K, Bund A, Plieth W, Bentien A, Paschen S, Plotner M, Grafe H, Fischer WJ (2003) J Solid State Electrochem 7:714–723
Heo P, Hagiwara K, Ichino R, Okido M (2006) J Electrochem Soc 153:C213–C217
Yoo BY, Huang CK, Lim JR, Herman J, Ryan MA, Fleurial JP, Myung NV (2005) Electrochim Acta 50:4371–4377
Michel S, Diliberto S, Stein N, Bolle B, Boulanger C (2008) J Solid State Electrochem 12:95–101
Lee J, Farhangfar S, Lee J, Cagnon L, Scholz R, Gosele U, Nielsch K (2008) Nanotechnology 19:365701–365708
Liu C (2006) Foundations of MEMS. Pearson Education Inc., New Jersey
Liu DW, Li JF (2008) J Electrochem Soc 155:D493–D498
Dixit P, Miao JM (2006) J Electrochem Soc 153:G552–G559
Chandrasekar MS, Pushpavanam M (2008) Electrochim Acta 53:3313–3322
Yang H, Chein RY, Tsai TH, Chang JC, Wu JC (2006) Microsyst Technol 12:187–192
Acknowledgments
This work was supported by the Ministry of Science and Technology of China (Grant no. 2007CB607505) and National Nature Science Foundation (Grant no. 50820145203).
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Liu, DW., Li, JF. Microfabrication of thermoelectric modules by patterned electrodeposition using a multi-channel glass template. J Solid State Electrochem 15, 479–484 (2011). https://doi.org/10.1007/s10008-010-1104-y
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DOI: https://doi.org/10.1007/s10008-010-1104-y