Abstract.
The underpotential deposition of copper onto polycrystalline rhodium was studied as a function of the degree of oxidation of the electrode surface in acidic media using potentiodynamic techniques. Surface oxidation of the rhodium electrode was carried out using a triangular sweep potential between E L (lower limit) and E U (upper limit: 0.94≤E U≤1.4 V). Cu electrodeposition was performed at the same time as the total or partial reduction of the oxidized species. The surface oxides produced at E U≤1.09 V were completely reduced during Cu electrodeposition. In this case, the potentiodynamic I-E patterns for oxidative dissolution of Cu were characterized by three anodic peaks located at 0.41 V (peak I), 0.47 V (peak II) and 0.59 V (peak III) and the coverage degree by Cu, θCu, was on the order of a monolayer. Surface oxides produced at E U>1.09 V were partially reduced during the copper electrodeposition. In this case, the I-E profiles exhibited only two anodic peaks (II and III) and θCu was <1. The Rh-oxygen species that remain on the electrode surface block the active sites of lower energy and modify the binding energy of strongly adsorbed Cu.
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Salgado, L., Meas, Y. & Trejo, G. Influence of the degree of surface oxidation of polycrystalline Rh electrodes on the underpotential deposition of Cu. J Solid State Electrochem 7, 37–42 (2002). https://doi.org/10.1007/s10008-002-0282-7
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DOI: https://doi.org/10.1007/s10008-002-0282-7