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The density and surface tension of In–Sn and Cu–In–Sn alloys

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Abstract

The density and surface tension of binary In–Sn and ternary Cu–In–Sn alloys have been measured by a sessile-drop method. Decrease of the density and of the surface tension was observed with rising temperature. With increased Sn content in the alloys, the density increased while the surface tension reduced slightly. Addition of Cu could significantly increase the density and surface tension in the Cu–In–Sn system. The surface tension of the Cu–In–Sn alloys was also calculated by means of Butler’s equation, and compared with experimental values, showing good agreement.

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Acknowledgments

Financial support of this investigation from the Austrian Science Foundation (FWF) under grant nos. P20488-N19 is gratefully acknowledged.

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Authors and Affiliations

  1. Institute of Inorganic Chemistry/Material Chemistry, University of Vienna, Währingerstraße 42, 1090, Vienna, Austria

    Zhongnan Guo, Michael Hindler & Adolf Mikula

  2. Department of Chemistry, School of Applied Science, University of Science and Technology Beijing, Xueyuan Road 30, 100083, Beijing, People’s Republic of China

    Wenxia Yuan

Authors
  1. Zhongnan Guo
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  2. Michael Hindler
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  3. Wenxia Yuan
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  4. Adolf Mikula
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Correspondence to Zhongnan Guo.

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Guo, Z., Hindler, M., Yuan, W. et al. The density and surface tension of In–Sn and Cu–In–Sn alloys. Monatsh Chem 142, 579–584 (2011). https://doi.org/10.1007/s00706-011-0501-y

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  • DOI: https://doi.org/10.1007/s00706-011-0501-y

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