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The fabrication of LIGA mask using photolithography and synchrotron radiation lithography

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Abstract

 The fabrication of LIGA mask is a very important step in LIGA process. Usually an intermediate mask with gold absorber pattern of 2 μm thickness is fabricated firstly using gold electroplating for absorber pattern in the resist structure written by Electron Beam (e-Beam), then the LIGA mask can be copied from the intermediate mask using synchrotron radiation lithography and gold electroplating.

Recently, we use photolithography (instead of e-beam) to make the primary structure, and produce the intermediate mask with gold absorber pattern of 1.5 μm thickness produced by etching gold film with 1.5 μm thickness under the photoresist structure using Ar+. The LIGA mask with absorber pattern of 13 μm thickness is copied from the intermediate mask using synchrotron radiation lithography and gold electroplating.

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Received: 30 October 1995/Accepted: 9 December 1995

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Yi, F., Jin, M., Tang, E. et al. The fabrication of LIGA mask using photolithography and synchrotron radiation lithography. Microsystem Technologies 3, 7–9 (1996). https://doi.org/10.1007/s005420050046

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  • DOI: https://doi.org/10.1007/s005420050046

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