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Fabrication of SU-8 photoresist micro–nanofluidic chips by thermal imprinting and thermal bonding

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Abstract

Micro–nanofluidic chips have been widely applied in biological and medical fields. In this paper, a simple and low-cost fabrication method for micro–nano fluidic chips is proposed. The nano-channels are fabricated by thermal nano-imprinting on an SU-8 photoresist layer followed by thermal bonding with a second SU-8 photoresist layer. The micro-channels are produced on the second layer by UV exposure and then thermal bonded by a third layer of SU-8 photoresist. The final micro–nano fluidic chip consists of micro-channels (width of 200.0 ± 0.1 μm and, depth of 8.0 ± 0.1 μm) connected by nano-channels (width of 533 ± 6 nm and, depth of 372 ± 6 nm), which has great potential in molecular filtering and detection.

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Acknowledgements

This work is supported by National Natural Science Foundation of China (No. 51775088).

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Authors and Affiliations

  1. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, China

    Lei Sun, Lingpeng Liu, Ran Guo, Kehong Li & Helin Zou

  2. Department of Biomedical Engineering, Dalian University of Technology, Dalian, China

    Liping Qi

  3. School of Mechanical Science and Engineering, Jilin University, Changchun, China

    Zhifu Yin

  4. Key Laboratory for Micro/Nano Technology and Systems of Liaoning Province, Dalian University of Technology, Dalian, China

    Dongjiang Wu & Helin Zou

  5. School of Physical Science and Technology, Dalian University, Dalian, China

    Jiangang Zhou

Authors
  1. Lei Sun
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  2. Lingpeng Liu
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  3. Liping Qi
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  4. Ran Guo
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  5. Kehong Li
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  6. Zhifu Yin
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  7. Dongjiang Wu
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  8. Jiangang Zhou
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  9. Helin Zou
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Correspondence to Helin Zou.

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Sun, L., Liu, L., Qi, L. et al. Fabrication of SU-8 photoresist micro–nanofluidic chips by thermal imprinting and thermal bonding. Microsyst Technol 26, 861–866 (2020). https://doi.org/10.1007/s00542-019-04565-2

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  • DOI: https://doi.org/10.1007/s00542-019-04565-2

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