Abstract
In this paper, a thermal resistance network model is established for calculating arm electronics (AE) chip junction temperature to ambient. The thermal resistance network is based on heat transfer paths from chip to ambient. This network can be used to predict AE chip junction temperature to ambient under thermal managements. The accuracy of the presented model is also proven through comparing the results of numerical calculation and simulation. A piezoelectric micro-thermal energy harvester is designed and placed on top of AE chip. Finite element analysis (FEA) software is used to establish the model of PZT membrane generator and analyze piezoelectric characteristics of PZT membrane. The relationship between average voltage output and electrode size is shown.
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References
Huesgen T et al (2010) Detailed study of a micro heat engine for thermal energy harvesting. J Micromech Microeng 20:1–9. doi:10.1088/0960-1317/20/10/104004
Husain A, Kim KY (2008) Shape optimization of micro-channel heat sink for micro-electronic cooling. IEEE Trans Compon Packag Technol 31:322–330. doi:10.1109/TCAPT.2008.916791
Lee TY (2000) An investigation of thermal enhancement on flip chip plastic BGA packages using CFD tool. IEEE Trans Compon Packag Technol 3:481–489. doi:S1521-3331(00)06498-9
Lee YC, Ghaffari HT (1989) Internal thermal resistance of a multi-chip packaging design for VLSI based systems. IEEE Trans Compon Hybrids Manuf Technol 2:163–169. doi:0148-6411/89/0600-0163
Luo XB (2010) An analytical thermal resistance model for calculating mean die temperature of a typical BGA packaging. Thermochimica Acta. doi: 10.1016/j.tca.2010.10.009
Muzychka YS (2003) Thermal spreading resistance of eccentric heat sources on rectangular flux channels. ASME 125:178–185. doi:10.1115/1.1568125
Richards C, Bahr D et al (2003) Design, fabrication and testing of the P3 micro heat engine. Sens Actuators A 104:290–298. doi:10.1016/S0924-4247(03)00032-3
Richards C, Bahr D et al (2004) High strain behavior of composite thin film piezoelectric membranes. Microelectron Eng 75:12–23. doi:10.1016/j.mee.2003.10.007
Song GE et al (2007) Simulation and experiments for a phase-change actuator with bistable membrane. Sens Actuators A 136:665–672. doi:10.1016/j.sna.2006.12.018
Wei XJ, Joshi Y (2003) Optimization study of stacked micro-channel heat sinks for micro-electronic cooling. IEEE Trans Compon Packag Technol 26:55–61. doi:10.1109/TCAPT.2003.811473
Weiss LW (2008) Resonant operation and cycle work from a MEMS-based micro-heat engine. Microsyst Technol 15:485–492. doi:10.1007/s00542-008-0716-y
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Chang, JY., Wu, D. Depletion and harvesting thermal energy from actuator arm electronics in hard disk drives. Microsyst Technol 18, 1401–1406 (2012). https://doi.org/10.1007/s00542-012-1556-3
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DOI: https://doi.org/10.1007/s00542-012-1556-3