Abstract
A novel integrated thermal management solution is proposed to alleviate hot spots in a contemporary 3D IC architecture. The solution employs a series of integrated microchannels, interconnected through each stratum by through silicon fluidic vias (TSFVs), and permits the transfer of heat, via a coolant, from hot to cold zones. This microfluidic system is driven by an integrated AC electrokinetic pump embedded in the channel walls. Recent advancements in electrokinetic micropump technology have allowed greater increases in fluid velocity (mm/s) while operating within the voltage constraints of a 3D IC. This paper presents a 2D simulation of an electrokinetic micropump operating at Vpp = 1.5 V in a 40 μm channel and examines its velocity profile for six frequencies in the range 100 ≤ ω ≤ 100 MHz. An optimum frequency of 100 kHz was established within this range and this was further examined with a constant heat flux of 186 W/cm² imposed on the wall for an inlet fluid temperature of 40°C. Temperature profiles are presented at the channel-silicon interface and compared with theory.
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Kearney, D., Hilt, T. & Pham, P. A numerical hydrodynamic and thermal characterization of an inter-strata liquid cooling solution for 3D ICs. Microsyst Technol 18, 225–235 (2012). https://doi.org/10.1007/s00542-011-1376-x
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DOI: https://doi.org/10.1007/s00542-011-1376-x