Skip to main content
SpringerLink
Log in

A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging

  • Technical Paper
  • Published:
Microsystem Technologies Aims and scope Submit manuscript

Abstract

In the process of piezo-resistive pressure sensor packaging, a simple thermo-compression bonding setup has been fabricated to achieve the wire bonding interconnection of a silicon chip with printed circuit board. An annealed gold wire is joined onto a pad surface with a needle-like chisel under a force of 0.5–1.5 N/point. The temperature of the substrate was maintained in the range of 150–200°C and the temperature of the chisel was fixed at around 150°C during wire bonding operation. The tensile strength of the wire bonding was measured with a bonding tester by the destructive-pulling experiment and was found to be at the average of 132 mN/mm2. The microstructure of the bonding point was examined by scanning electron microscopy. The interface of the thermo-compression boning was shown to possess an acceptable level of reliability for a micro-electromechanical system (MEMS)-based device. The results showed that this setup can be easily operated for fabrication and is suitable for fabricating not only low-cost pressure sensors, but also other MEMS devices.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7

Similar content being viewed by others

References

  • Bao MH (2000) Micro mechanical transducers-pressure sensors. Elsevier, Amsterdam

    Google Scholar 

  • Burla RK, Chen L, Zorman CA, Mehregany M (2009) Development of nickel wire bonding for high-temperature packaging of SiC devices. IEEE Trans Adv Pack 32:64

    Article  Google Scholar 

  • Crescini D, Ferrari V, Vajna ZK, Marioli D, Taroni A, Borgese A, Marinelli M, Milani E, Paoletti A, Tucciarone A (2003) Design and development of a piezoresistive pressure sensor on micromachined silicon for high-temperature applications and of a signal-conditioning electronic circuit. Microsyst Technol 9(6–7):431–435

    Article  Google Scholar 

  • Fahrner WR, Job R, Werner M (2001) Sensors and smart electronics in harsh environment applications. Microsyst Technol 7(4):138–144

    Article  Google Scholar 

  • Fraga MA, Massi M, Furlan H, Oliveira IC, Rasia LA, Mateus CFR (2011) Preliminary evaluation of the influence of the temperature on the performance of a piezoresistive pressure sensor based on a-SiC film. Microsyst Technol 17(3):477–480

    Article  Google Scholar 

  • Fragiacomo G, Ansbaek T, Pedersen T, Hansen O, Thomsen EV (2010) Analysis of small deflection touch mode behavior in capacitive pressure sensors. Sens Actuators A 161(1–2):114–119

    Google Scholar 

  • Harmon GG (2010) Wire bonding in microelectronics. McGraw-Hill, New York

    Google Scholar 

  • Kim Y, Kim H, Yoo HJ (2010) Electrical characterization of screen-printed circuits on the fabric. IEEE Trans Adv Pack 33(1):196

    Article  MathSciNet  Google Scholar 

  • Lee WJ (2002) Mechanical properties of electroless Ni/Au wire bonded to an Al pad with the effects of chemical activation. Thin Solid Films 408(1–2):176–182

    Google Scholar 

  • Lellouchi D, Dhennin J, Lafontan X, Veyrie D, Neal JFL, Pressecq F (2010) A new method for the hermeticity testing of wafer-level packaging. J Micromech Microeng 20(2):025031

    Article  Google Scholar 

  • Mohammadi AR, Bennington CPJ, Chiao M (2011) A hybrid capacitive pressure and temperature sensor fabricated by adhesive bonding technique for harsh environment of kraft pulp digesters. Microsyst Technol 17(1):149–160

    Article  Google Scholar 

  • Orthner MP, Buetefisch S, Magda J, Rieth LW, Solzbacher F (2010) Development, fabrication, and characterization of hydrogel based piezoresistive pressure sensors with perforated diaphragms. Sens Actuators A 161(1–2):29–38

    Google Scholar 

  • Prasad SK (2004) Advanced wire bond interconnection technology. Kluwer Academic Publishers, Massachusetts

    Google Scholar 

  • Unami N, Sakuma K, Mizuno J, Shoji S (2010) Effects of excimer irradiation treatment on thermocompression Au–Au Bonding. Japanese J Appl Phys 49(6):06GN12

    Google Scholar 

  • Weinberg K, Bohme T (2009) Condensation and growth of kirkendall voids in intermetallic compounds. IEEE Trans Compon Pack Technol 32(3):684–692

    Article  Google Scholar 

  • Xie GX, Luo JB, Liu SH, Guo D, Zhang CH (2010) Bubble generation in a nanoconfined liquid film between dielectric-coated electrodes under alternating current electric fields. Appl Phys Lett 96:223104

    Article  Google Scholar 

Download references

Acknowledgments

This work was supported by the National Science Foundation of China (No. 51175238), the Starting Foundation of Jiangsu University Advanced Talent (No. 09JDG045), and Chinese Post Doctor Special science Foundation (No. 201003557) and Industrial Supporting Plan of Zhengjiang City (No. GY20100010).

Author information

Authors and Affiliations

  1. Mechanical Engineering School, Jiangsu University, Zhenjiang, 212013, People’s Republic of China

    Quan Wang, Xiaodan Yang, Yanmin Zhang & Jianning Ding

  2. State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Shanghai, 200050, People’s Republic of China

    Quan Wang

Authors
  1. Quan Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Xiaodan Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Yanmin Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Jianning Ding
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Quan Wang.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Wang, Q., Yang, X., Zhang, Y. et al. A simple thermo-compression bonding setup for wire bonding interconnection in pressure sensor silicon chip packaging. Microsyst Technol 17, 1629 (2011). https://doi.org/10.1007/s00542-011-1345-4

Download citation

  • Received:

  • Accepted:

  • Published:

  • DOI: https://doi.org/10.1007/s00542-011-1345-4

Keywords

Search

Navigation