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High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process

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Abstract

This paper describes a theoretical model that predicts the metal ion concentration distribution during electroforming high aspect ratio microstructures (HARM). The applied current density and microstructure aspect ratio were found as two important factors that affect the electroforming outcome. The analytical results are verified using experiments that electroforming microstructural posts with an aspect ratio of 10. Good agreement was obtained between the experimental and analytical solutions. Based on the ion concentration analytical prediction on the cathode surface, one can estimate the electroforming time required for fabricating a microstructure for a given aspect ratio.

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References

  • Bauer W et al (1998) Slip casting of ceramic microcomponents. Microsyst Technol 4:125–127

    Article  Google Scholar 

  • Becker E et al (1986) Fabrication of microstructures with extreme structure heights by synchrotron radiation lithography, galvanoforming and plastic moulding (LIGA process). Microelectron Eng 4:35–56

    Article  Google Scholar 

  • Grande WC, Talbot JB (1993) Electrodeposition of thin films of Nickel–Iron. J Electrochem Soc 140:675–681

    Article  Google Scholar 

  • Griffiths SK et al (1998) Modeling electrodeposition for LIGA microdevice fabrication. Microsyst Technol 4:98–101

    Article  Google Scholar 

  • Hulsenberg et al (1996) High aspect ratio structures obtained by electroforming in microstructured glass. Microsyst Technol 2:109–113

    Article  Google Scholar 

  • Laidler KJ, Meiser JH (1999) Physical chemistry. Cole Publishing Co, CA

    Google Scholar 

  • Leyendecker K et al (1994) New microelectrodes for the investigation of the electroforming of LIGA microstructures. Electrochimica Acta 39:1139–1143

    Article  Google Scholar 

  • Maner A et al (1988) Mass production of microdevices with extreme aspect ratios by electroforming. Plating Surf Finishing 75:111–123

    Google Scholar 

  • Tsai TH et al (2004a) High-aspect-ratio microstructure filling by centrifugal force field modeling. Microsyst Tecnol 10:571–577

    Article  Google Scholar 

  • Tsai TH et al (2004b) New electroforming technology pressure id for LIGA process. Microsyst Technol 10:351–356

    Article  Google Scholar 

  • Varadarajan D et al (2000) A tertiary current distribution model for the pulse plating of copper into high aspect ratio sub-0.25 μm trenches. J Electrochem Soc 147:3382–3392

    Article  MathSciNet  Google Scholar 

  • Wylie CR (1982) Advanced engineering mathematics, 4th edn. Wiley, NY

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Authors and Affiliations

  1. Institute of Precision Engineering, National Chung Hsing University, Taichung, 402, Taiwan

    H. Yang

  2. Department of mechanical Engineering, National Chung Hsing University, Taichung, 402, Taiwan

    Reiyu Chein & T. H. Tsai

  3. Physical Chemistry Section, Chung-Shan Institute of Science and Technology, Tao-Yuan, 325, Taiwan

    J. C. Chang & J. C. Wu

Authors
  1. H. Yang
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  2. Reiyu Chein
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  3. T. H. Tsai
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  4. J. C. Chang
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  5. J. C. Wu
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Correspondence to Reiyu Chein.

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Yang, H., Chein, R., Tsai, T.H. et al. High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process. Microsyst Technol 12, 187–192 (2006). https://doi.org/10.1007/s00542-005-0050-6

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  • DOI: https://doi.org/10.1007/s00542-005-0050-6

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