Abstract
Within the last three decades, thin films grown by physical vapor deposition methods have found widespread applications. This article reports about recent research examples on molybdenum thin films, as used for thin film transistor liquid crystal displays, and on TiN diffusion barrier films, as used for microelectronics.
Zusammenfassung
Innerhalb der letzten drei Jahrzehnte haben dünne mit Hilfe der physikalischen Dampfphasenabscheidung hergestellte Schichten breite Anwendung gefunden. Dieser Beitrag berichtet über jüngste Forschungsbeispiele von Molybdänschichten für Dünnschichttransistor-Flüssigkristall-Bildschirme und von TiN-Barriereschichten für die Mikroelektronik.
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References
Mayrhofer, P.; Mitterer, C.; Hultman, L.; Clemens, H.: Microstructural design of hard coatings, Progress in Materials Science, 51 (2006), pp 1032–1114
Hultman, L.: Thermal stability of nitride thin films, Vacuum, 57 (2000), pp 1–30
Mitterer, C.: PVD and CVD hard coatings, in: Sarin, V.K. (Editor-in-Chief), Llanes, L.; Mari, D. (Vol. Eds.): Comprehensive hard materials, Vol. 2, Amsterdam: Elsevier, 2014, pp 449–467
Mitterer, C.; Waldhauser, W.: Nanostrukturierte Schichten – der Schlüssel zu multifunktionalen Oberflächen, Berg- und Hüttenmännische Monatshefte, 9 (2010), pp 409–416
Kuo, Y. (ed.): Thin film transistors, materials and processes, Volume 1: Amorphous silicon thin film transistors, Norwell: Kluwer, 2004, pp 321–324
Yen, Y.-W.; Kuo, Y.-L.; Chen, J.-Y.; Lee, C.; Lee, C.-Y.: Investigation of thermal stability of Mo thin-films as the buffer layer and various Cu metallization as interconnection materials for thin film transistor-liquid crystal display applications, Thin Solid Films, 515 (2007), pp 7209–7216
List, A.; Mitterer, C.; Mori, G.; Winkler, J.; Reinfried, N.; Knabl, W.: Oxidation of sputtered thin films of molybdenum alloys at ambient conditions, in: Sigl, L.; Rödhammer, P.; Wildner, H. (eds.): Proceedings of the 17th International Plansee Seminar, Reutte, Austria, 2009, Reutte: Plansee, 2009, Vol. 1, RM12
Hofer, A. M.; Schlacher, J.; Keckes, J.; Winkler, J.; Mitterer, C.: Sputtered molybdenum films: structure and property evolution with film thickness, Vacuum, 99 (2014), pp 149–152
Stanoi, D.; Socol, G.; Grigorescu, C.; Guinneton, F.; Monnereau, O.; Tortet, L.; Zhang T.; Mihailescu, I. N.: Chromium oxides thin films prepared and coated in situ with gold by pulsed laser deposition, Materials Science and Engineering B, 118 (2005), pp 74–78
Park, K.-C.; Kim, K.-B.; Raaijmakers, I. J. M. M.; Ngan, K.: The effect of density and microstructure on the performance of TiN barrier films in Cu metallization, Journal of Applied Physics, 80 (1996), pp 5674–5681
Mühlbacher, M.; Mendez-Martin, F.; Sartory, B.; Schalk, N.; Keckes, J.; Lu, J.; Hultman, L.; Mitterer, C.: Copper diffusion into single-crystalline TiN studied by transmission electron microscopy and atom probe tomography, Thin Solid Films, 574 (2015), pp 103–109
Acknowledgements
The part of this work on functional display thin films was supported by the Forschungsförderungsgesellschaft mbH within the Headquarters project E2SPUTTERTECH. Financial support for the activities on diffusion barrier layers by the Austrian Federal Government (in particular by the Bundesministerium für Verkehr, Innovation und Technologie and Bundesministerium für Wirtschaft, Familie und Jugend) represented by Österreichische Forschungsförderungsgesellschaft mbH and the Styrian and the Tyrolean Provincial Governments, represented by Steirische Wirtschaftsförderungsgesellschaft mbH and Standortagentur Tirol, within the framework of the COMET Funding Programme is also gratefully acknowledged. The authors are also grateful to Dr. Jörg Winkler, PLANSEE SE, Reutte, Austria, for collaboration and helpful discussions.
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Mitterer, C., Jörg, T., Franz, R. et al. Functional Thin Films for Display and Microelectronics Applications. Berg Huettenmaenn Monatsh 160, 231–234 (2015). https://doi.org/10.1007/s00501-015-0354-5
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DOI: https://doi.org/10.1007/s00501-015-0354-5