Quenching of electroluminescence and charge trapping in high-efficiency Ge-implanted MOS light-emitting silicon diodes

Abstract

Combined measurements of charge trapping and electroluminescence intensity as a function of injected charge and current have been carried out with the aim of clarifying the mechanisms of electroluminescence (EL) quenching in Ge-implanted ITO-SiO₂-Si light-emitting silicon diodes. Good correlation between the negative charge capture in traps of small effective capture cross-sections (σ_t1 ^e=1.7×10^-19 cm² and σ_t2 ^e=4.8×10^-20 cm²) located in SiO₂, and the quenching of the asymmetrical EL line with a maximum intensity at 400 nm has been observed. Similar correlation between the electron capture in traps with extremely small effective capture cross-section (σ_t3 ^e=5×10^-21 cm²) and the quenching of the EL line at 637 nm has been established. A quantitative model for the EL quenching has been developed, which takes into account the modification of the luminescent centers with subsequent electron capture at the newly generated traps. The model shows good agreement between simulation and experimental data. It also demonstrates that small effective capture cross-sections for electron charging during the EL quenching are determined by the probability of the luminescence centers (LCs) being disrupted, and enables one to estimate the Ge concentration associated with the EL at 400 nm.