Abstract
TiAl alloy is a new kind of lightweight high temperature resistant structural material. Its density is only about half of that of nickel-based superalloy. It is an excellent substitute material for nickel-based superalloy. TiAl alloy is a brittle material that needs to be processed in the plastic domain on the nanoscale. Due to the influence of humidity, a thin water film will inevitably condenses on the processed surface. Therefore, it is necessary to consider the role of humidity in nanofabrication. The results show that when the water layer thickness is 0, 4 Å and 8 Å, the maximum tangential grinding force is 165 nN, 266 nN and 386 nN, and the maximum normal grinding force is 517 nN, 521 nN and 528 nN, respectively. Compared with the normal grinding force, the stress value of tangential grinding force changes more obviously. The variation of the peak value of radial distribution function (RDF) around Al atoms before and after grinding is smaller than that of Ti. From the second peak to the sixth peak, with the increasing of the water layer thickness, the peak of the wave crest gradually decreases. When the grinding wheel is rotating forward, the maximum tangential grinding force is 266 nN and the maximum normal grinding force is 521 nN, when the wheel is rotating backward, the maximum tangential grinding force is 497 nN and the maximum normal grinding force is 451 nN.
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The data on which the study is based were accessed from a repository and are available for downloading through the following link. https://lammpstube.com/mdpotentials/.
References
X. Huang, Z. Li, H. Huang, Research progress of new high temperature titanium alloys for high thrust-to-weight ratio aero engines. Adv. Mater. China 30(6), 21–27 (2011)
R. Gerling, F.P. Schimansky, A. Stark et al., Microstructure and mechanical properties of Ti 45Al 5Nb+(0–0.5 C) sheets. Intermetallics 16(5), 689–697 (2008)
J. Crespo-Villegas, M. Cavarroc, S. Knittel et al., Protective TixSiy coatings for enhanced oxidation resistance of the ɣ-TiAl alloy at 900 C. Surf. Coat. Technol. 430, 127963 (2022)
F. Klocke, S.L. Soo, B. Karpuschewski et al., Abrasive machining of advanced aerospace alloys and composites. CIRP Ann. 64(2), 581–604 (2015)
D.K. Aspinwall, R.C. Dewes, A.L. Mantle, The machining of γ-TiAI intermetallic alloys. CIRP Ann. 54(1), 99–104 (2005)
X.X. Xi, T.Y. Yu, W.F. Ding et al., Grinding of Ti2AlNb intermetallics using silicon carbide and alumina abrasive wheels: tool surface topology effect on grinding force and ground surface quality. Precis. Eng. 53, 134–145 (2018)
X.X. Xi, W.F. Ding, Z. Li et al., High speed grinding of particulate reinforced titanium matrix composites using a monolayer brazed cubic boron nitride wheel. Int. J. Adv. Manuf. Technol. 90, 1529–1538 (2017)
A. Beranoagirre, L.N. Lópezdelacalle, Grinding of gamma TiAl intermetallic alloys. Procedia Eng. 63, 489–498 (2013)
R. Hood, P. Cooper, D.K. Aspinwall, S.L. Soo, D.S. Lee, Creep feed grinding of γ-TiAl using single layer electroplated diamond superabrasive wheels. Manuf. Sci. Technol. 11, 36–44 (2015)
A.L. Mantle, D.K. Aspinwall, Surface integrity of a high speed milled gamma titanium aluminide. J. Mater. Process. Technol. 118(1–3), 143–150 (2001)
A.L. Mantle, D.K. Aspinwall, Cutting force evaluation when high speed end milling a gamma titanium aluminide intermetallic alloy. Intermetall. Superalloys 10, 209–215 (2000)
R. Hood, F. Lechner, D.K. Aspinwall, W. Voice, Creep feed deep grinding of gamma titanium aluminide and burn resistant titanium alloys using SiC abrasive. Int. J. Mach. Tool Manuf. 47, 1486–1492 (2007)
R. Hood, P. Cooper, D.K. Aspinwall et al., Creep feed grinding of γ-TiAl using single layer electroplated diamond superabrasive wheels. CIRP J. Manuf. Sci. Technol. 11, 36–44 (2015)
X. Xi, W. Ding, Y. Fu et al., Grindability evaluation and tool wear during grinding of Ti2AlNb intermetallics. Int. J. Adv. Manuf. Technol. 94, 1441–1450 (2018)
S. Biyik, F. Arslan, M. Aydin, Arc-erosion behavior of boric oxide-reinforced silver-based electrical contact materials produced by mechanical alloying. J. Electron. Mater. 44, 457–466 (2015)
S. Biyik, M. Aydin, The effect of milling speed on particle size and morphology of Cu25W composite powder. Acta Phys. Pol. A 127(4), 1255–1260 (2015)
S. Biyik, Characterization of nanocrystalline Cu25Mo electrical contact material synthesized via ball milling. Acta Phys. Pol. A 132(3), 886–888 (2017)
S. Biyik, M. Aydin, Optimization of mechanical alloying parameters of Cu25W electrical contact material. Acta Phys. Pol. A 132(3), 909–912 (2017)
S. Biyik, M. Aydin, Fabrication and arc-erosion behavior of Ag8SnO2 electrical contact materials under inductive loads. Acta Phys. Pol. A 131(3), 339–342 (2017)
S. Biyik, Effect of reinforcement ratio on physical and mechanical properties of Cu–W composites synthesized by ball milling. Mater. Focus 7(4), 535–541 (2018)
S. Biyik, Effect of polyethylene glycol on the mechanical alloying behavior of Cu–W electrical contact material. Acta Phys. Pol. A 134(1), 208–212 (2018)
S. Biyik, Effect of cubic and hexagonal boron nitride additions on the synthesis of Ag–SnO2 electrical contact material. J. Nanoelectron. Optoelectron. 14(7), 1010–1015 (2019)
S. Biyik, Influence of type of process control agent on the synthesis of Ag8ZnO composite powder. Acta Phys. Pol. A 135(4), 778–781 (2019)
O. Güler, T. Varol, Ü. Alver et al., The wear and arc erosion behavior of novel copper based functionally graded electrical contact materials fabricated by hot pressing assisted electroless plating. Adv. Powder Technol. 32(8), 2873–2890 (2021)
S. Liu, H. Ding, H. Zhang et al., High-density deformation nanotwin induced significant improvement in the plasticity of polycrystalline γ-TiAl-based intermetallic alloys. Nanoscale 10(24), 11365–11374 (2018)
C. Yao, J. Lin, D. Wu et al., Surface integrity and fatigue behavior when turning γ-TiAl alloy with optimized PVD-coated carbide inserts. Chin. J. Aeronaut. 31(4), 826–836 (2018)
M.J. Jackson, G.M. Robinson, M.D. Whitfield et al., Micro-and Nanomachining [M]//Emerging Nanotechnologies for Manufacturing (William Andrew Publishing, Norwich, 2015), pp.202–229
B. Li, F. Liu, C. Li et al., Effect of Cr element on the microstructure and oxidation resistance of novel NiAl-based high temperature lubricating composites. Corros. Sci.. Sci. 188, 109554 (2021)
Z. Ou, W. Wu, H. Dai, Molecular dynamics simulation-based study of single-crystal 3C-SiC nano-indentation with water film. Appl. Phys. A 129(9), 658 (2023)
M.S. Daw, M.I. Baskes, Embedded-atom method: derivation and application to impurities, surfaces, and other defects in metals. Phys. Rev. B 29(12), 6443 (1984)
J. Tersoff, New empirical approach for the structure and energy of covalent systems. Phys. Rev. B 37(12), 6991–7000 (1988)
Z.P. Hao, R.R. Cui, Y.H. Fan et al., Diffusion mechanism of tools and simulation in nanoscale cutting the Ni–Fe–Cr series of nickel-based superalloy. Int. J. Mech. Sci. 150, 625–636 (2018)
T. Liang, P. Zhang, P. Yuan et al., In-plane thermal transport in black phosphorene/graphene layered heterostructures: a molecular dynamics study. Phys. Chem. Chem. Phys. 20(32), 21151–21162 (2018)
A.K. Rappé, C.J. Casewit, K.S. Colwell et al., UFF, a full periodic table force field for molecular mechanics and molecular dynamics simulations. J. Am. Chem. Soc. 114(25), 10024–10035 (1992)
M.P. Allen, D.J. Tildesley, Computer Simulation of Liquids (Clarendon Press, Oxford, 1987)
B. Wang, W. Qiang, T. Wang et al., Molecular dynamics simulation of wetting behavior of nano-water droplets on nano-rough wall. J. Chem. Eng. Univ. 31(5), 1169–1176 (2017)
S.L. Mayo, B.D. Olafson, W.A. Goddard, DREIDING: a generic force field for molecular simulations. J. Phys. Chem. 94(26), 8897–8909 (1990)
L.A. Girifalco, V.G. Weizer, Application of the Morse potential function to cubic metals. Phys. Rev. 114(3), 687 (1959)
J. Tersoff, Modeling solid-state chemistry: Interatomic potentials for multicomponent systems. Phys. Rev. B 39(8), 5566 (1989)
R.L. Hecker, S.Y. Liang, X.J. Wu et al., Grinding force and power modeling based on chip thickness analysis. Int. J. Adv. Manuf. Technol. 33, 449–459 (2007)
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Chen, L. Effect of humidity on grinding force of TiAl alloy at nanometer scale. Appl. Phys. A 130, 234 (2024). https://doi.org/10.1007/s00339-024-07387-w
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DOI: https://doi.org/10.1007/s00339-024-07387-w