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Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints

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Abstract

The effects of porous copper (P-Cu) on the microstructure, hardness, and shear strength of SnBi, SnBi-0.4Ag, and SnBi-1Ag solder joints were investigated in this paper. The experimental results show that P-Cu frames distribute in the solder bulks and form triangular areas. The addition of P-Cu leads to the microstructural refinement in the enclosed areas by the P-Cu frames in the solder bulks. The average hardness here is increased due to the fine grain strengthening mechanism. The SnBi-1Ag@P-Cu solder bulk shows smaller Bi-rich grains but larger β-Sn dendrites than the other two P-Cu-enhanced solder bulks. Porous Cu exists as a frame structure in the solder joints, which hinders the initiation and propagation of cracks and has a positive effect on the improvement of joint strength. Compared to the SnBi and SnBiAg solder joints, the shear strength of the P-Cu-enhanced solder joints is increased by 15%. The average shear strength of the SnBi-0.4Ag@P-Cu solder joint is 79.34 MPa, which is the highest among all the solder joints investigated in this study.

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Acknowledgements

This work is supported by National Natural Science Foundation of China (No. 51604090) and Natural Science Foundation of Heilongjiang Province (No. E2017050).

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Authors and Affiliations

  1. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, 225127, China

    Yang Liu, Boqiao Ren, Min Zhou, Yuxiong Xue & Xianghua Zeng

  2. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, 150040, China

    Boqiao Ren & Fenglian Sun

  3. Department of Mechanical Engineering, Lamar University, Beaumont, TX, 77710, USA

    Xuejun Fan

  4. EEMCS Faculty, Delft University of Technology, 2628CD, Delft, The Netherlands

    Guoqi Zhang

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  1. Yang Liu
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Liu, Y., Ren, B., Zhou, M. et al. Effect of porous Cu addition on the microstructure and mechanical properties of SnBi-xAg solder joints. Appl. Phys. A 126, 735 (2020). https://doi.org/10.1007/s00339-020-03926-3

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