Abstract
The HfO x films grown on Pt substrates were deposited at different temperatures by RF magnetron sputtering. The crystal quality of HfO x film increased with the increasing deposition temperature. Typical bipolar resistive switching (RS) characteristics were observed in prepared samples. The sample deposited at 100 °C showed the best RS performance with large ON/OFF ratio, concentrated distribution of switching voltages and good reliability. Reset-first RS behavior was observed for the 300 °C deposited sample due to the high density of defects and the diffusion of Cu in the film. The distinct RS behaviors are closely related to the microproperties of the films. The possible switching mechanisms were discussed.
Similar content being viewed by others
References
H.Y. Lee, P.S. Chen, T.Y. Wu, Y.S. Chen, F. Chen, C.C. Wang, P.J. Tzeng, C.H. Lin, M.J. Tsai, C. Lien, IEEE Electron Device Lett. 30, 703–705 (2009)
Y. Li, G. Zhao, J. Su, E. Shen, Y. Ren, Appl. Phys. A 104, 1069–1073 (2011)
C.H. Jia, Q.C. Dong, W.F. Zhang, J. Alloys Compd. 520, 250–254 (2012)
D.S. Lee, Y.H. Sung, I.G. Lee, J.G. Kim, H. Sohn, D.H. Ko, Appl. Phys. A 102, 997–1001 (2011)
Y. Wang, Q. Liu, S. Long, W. Wang, Q. Wang, M. Zhang, S. Zhang, Y. Li, Q. Zuo, J. Yang, M. Liu, Nanotechnology 21, 045202 (2010)
I. Salaoru, T. Prodromakis, A. Khiat, C. Toumazou, Appl. Phys. Lett. 102, 013506 (2013)
K.L. Lin, T.H. Hou, J. Shieh, J.H. Lin, C.T. Chou, Y.J. Lee, J. Appl. Phys. 109, 084104 (2011)
D.L. Xu, Y. Xiong, M.H. Tang, B.W. Zeng, J.Q. Li, L. Liu, L.Q. Li, S.A. Yan, Z.H. Tang, Microelectron. Eng. 116, 22–25 (2014)
H.Y. Jeong, Y.I. Kim, J.Y. Lee, S.Y. Choi, Nanotechnology 21, 115203 (2010)
H. Zhang, L. Liu, B. Gao, Y. Qiu, X. Liu, J. Lu, R. Han, J. Kang, B. Yu, Appl. Phys. Lett. 98, 042105 (2011)
C. Chen, S. Gao, F. Zeng, G.S. Tang, S.Z. Li, C. Song, H.D. Fu, F. Pan, J. Appl. Phys. 114, 014502 (2013)
A. Mosbah, M.S. Aida, J. Alloys Compd. 515, 149–153 (2012)
A. Sreedhar, M. Hari Prasad Reddy, S. Uthanna, J.F. Pierson, Int. J. ChemTech Res. 6, 1920–1922 (2014)
J.J. Yang, J.P. Strachan, Q. Xia, D.A.A. Ohlberg, P.J. Kuekes, R.D. Kelley, W.F. Stickle, D.R. Stewart, G. Medeiros-Ribeiro, R.S. Williams, Adv. Mater. 22, 4034–4038 (2010)
J.F. Chang, M.H. Hon, Thin Solid Films 386, 79–86 (2001)
V. Musat, B. Teixeira, E. Fortunato, R.C.C. Monteiro, P. Vilarinho, Surf. Coat. Technol. 180–181, 659–662 (2004)
Z.Q. Xu, H. Deng, Y. Li, Q.H. Guo, Y.R. Li, Mater. Res. Bull. 41, 354–358 (2006)
V. Dave, P. Dubey, H.O. Gupta, R. Chandra, AIP Conf. Proc. 1576, 29–32 (2014)
N. Takahashi, S. Nonobe, T. Nakamura, J. Solid State Chem. 177, 3944–3948 (2004)
S. Xing, N. Zhang, Z. Song, Q. Shen, C. Lin, Microelectron. Eng. 66, 451–456 (2003)
G.D. Wilk, R.M. Wallace, J.M. Anthoy, J. Appl. Phys. 87, 484–492 (2000)
S.Q. Wang, J.W. Mayer, J. Appl. Phys. 64, 4711–4716 (1988)
J. Dong, S.H. Huang, IEEE Trans. Nanotechnol. 13, 594–599 (2014)
J. Kim, S. Lee, K. Lee, H. Na, I.S. Mok, Y. Kim, D.H. Ko, H. Sohn, Microelectron. Eng. 112, 46–51 (2013)
J. Liu, K. Xu, Vac. Sci. Technol. (China) 24, 321–323 (2004)
M. Haemori, T. Nagata, T. Chikyow, Appl. Phys. Express 2, 061401 (2009)
H.C. Tseng, T.C. Chang, J.J. Huang, Y.T. Chen, P.C. Yang, H.C. Huang, D.S. Gan, N.J. Ho, S.M. Sze, M.J. Tsai, Thin Solid Films 520, 1656–1659 (2011)
C.Y. Huang, J.H. Jieng, W.Y. Jang, C.H. Lin, T.Y. Tseng, ECS Solid State Lett. 2, P63–P65 (2013)
U. Celano, Y.Y. Chen, D.J. Wouters, G. Groeseneken, M. Jurczak, W. Vandervorst, Appl. Phys. Lett. 102, 121602 (2013)
L.E. Yu, S. Kim, M.K. Ryu, S.Y. Choi, Y.K. Choi, IEEE Electron Device Lett. 29, 331–333 (2008)
Acknowledgments
This work was financially supported by the National Natural Science Foundation of China (No. 51202196), the National Aerospace Science Foundation of China (No. 2013ZF53067), the Natural Science Basic Research Plan in Shaanxi Province of China (No. 2014JQ6204), the Fundamental Research Funds for the Central Universities (No. 3102014JCQ01032) and the 111 Project (No. B08040).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Guo, T., Tan, T. & Liu, Z. Role of deposition temperature on performance of HfO x -based resistive switching. Appl. Phys. A 120, 121–125 (2015). https://doi.org/10.1007/s00339-015-9178-0
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s00339-015-9178-0