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Atomistic simulation of nanodrilling mechanics and mechanism on Cu substrates

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Abstract

The nanodrilling process of copper substrates is studied using molecular dynamics simulations. The effects of the rotation velocity of the tool and substrate temperature are evaluated in terms of atomic trajectories, slip vector, thrust force, stress, flow field, and hole characteristics. The simulation shows that the main hole-making mechanism for drilling with low rotation velocities (0.1°/ps or lower) is mechanical indentation. The number of removed atoms and influence area of the substrate increase with increasing rotation velocity of the tool. When the rotation velocity of the tool or substrate temperature increases, the influence area expands more in the radial direction than in the axial direction. The required thrust force for making a hole is lower at a higher rotation velocity of the tool and higher substrate temperature. Undesirable elastic recovery after drilling can be reduced by increasing the rotation velocity of the tool.

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Acknowledgments

This work was supported by the National Science Council of Taiwan under grants NSC 100-2628-E-151-003-MY3 and NSC 100-2221-E-151-018-MY3.

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Authors and Affiliations

  1. Department of Mechanical Engineering, Chung Yuan Christian University, 200, Chung Pei Rd., Chung Li City, Taoyuan County, 32023, Taiwan

    Cheng-Da Wu

  2. Department of Mechanical Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung, 807, Taiwan

    Te-Hua Fang & Ching-Hung Kuo

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  1. Cheng-Da Wu
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  2. Te-Hua Fang
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Correspondence to Te-Hua Fang.

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Wu, CD., Fang, TH. & Kuo, CH. Atomistic simulation of nanodrilling mechanics and mechanism on Cu substrates. Appl. Phys. A 118, 307–313 (2015). https://doi.org/10.1007/s00339-014-8732-5

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  • DOI: https://doi.org/10.1007/s00339-014-8732-5

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