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Fabrication and simulation of glass micromachining using CO2 laser processing with PDMS protection

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Abstract

Traditional glass micromachining using laser processing in air would produce many kinds of defects, such as bulges, debris, micro-cracks and scorches. In this article, a poly-dimethylsiloxane (PDMS) protection processing has been presented to reduce the temperature gradient and heat-affected zone (HAZ) to achieve crack-free Pyrex glass machining. A good quality of etched surface which is a clear and much-reduced bulge without crack and scorch is achieved using CO2 laser micromachining at 150 μm thick PDMS protection layer and the laser powers of 10–15 W and scanning speeds of 228–342 mm/s for five passes. The PDMS cover layer benefits feature size and bulge height reduction. The alpha-step measured profile shows that the much reduced bulge height around the rims of channel was about 1.2 μm at 150 μm thick PDMS about 13 times smaller than that in air. The ANSYS software was used to analyze the temperature distribution and thermal stress field of glass micromachining in air without and with PDMS cover layer. The smaller temperature gradient observed in PDMS protection processing has the smaller HAZ and diminishes the crack formation during the laser processing.

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References

  1. H. Zhu, M. Holl, T. Ray, S. Bhushan, D.R. Meldrum, Characterization of deep wet etching of fused silica glass for single cell and optical sensor deposition. J. Micromech. Microeng. 19, 065013 (2009) (8 pp.)

    Article  ADS  Google Scholar 

  2. K. Kolari, V. Saarela, S. Franssila, Deep plasma etching of glass for fluidic devices with different mask materials. J. Micromech. Microeng. 18, 064010 (2008) (6 pp.)

    Article  ADS  Google Scholar 

  3. C.K. Chung, H.C. Chang, T.R. Shih, S.L. Lin, E.J. Hsiao, Y.S. Chen, E.C. Chang, C.C. Chen, C.C. Lin, Water-assisted CO2 laser ablated glass and modified thermal bonding for capillary-driven bio-fluidic application. Biomed. Microdevices 12, 107–114 (2010)

    Article  Google Scholar 

  4. X.D. Cao, B.H. Kim, C.N. Chu, Micro-structuring of glass with features less than 100 μm by electrochemical discharge machining. Precis. Eng. 33, 459–465 (2009)

    Article  Google Scholar 

  5. A.S. Saragih, T.J. Ko, A thick SU-8 mask for microabrasive jet machining on glass. Int. J. Adv. Manuf. Technol. 41, 734–740 (2009)

    Article  Google Scholar 

  6. D.F. Farson, H.W. Choi, B. Zimmerman, J.K. Steach, J.J. Chalmers, S.V. Olesik, L.J. Lee, Femtosecond laser micromachining of dielectric materials for biomedical application. J. Micromech. Microeng. 18, 035020 (2008) (9 pp.)

    Article  ADS  Google Scholar 

  7. C.J. Hayden, A simple three-dimensional computer simulation tool for predicting femtosecond laser micromachined structures. J. Micromech. Microeng. 20, 025010 (2010) (11 pp.)

    Article  ADS  Google Scholar 

  8. Y. Zhou, M.H. Hong, J.Y.H. Fuh, L. Lu, B.S. Luk’yanchuk, Z.B. Wang, L.P. Shi, T.C. Chong, Direct femtosecond laser nanopatterning of glass substrate by particle-assisted near-field enhancement. Appl. Phys. Lett. 88, 023110 (2006)

    Article  ADS  Google Scholar 

  9. Z.Q. Huang, M.H. Hong, T.B.M. Do, Q.Y. Lin, Laser etching of glass substrates by 1064 nm laser irradiation. Appl. Phys. A, Mater. Sci. Process. 93(1), 159 (2008)

    Article  ADS  Google Scholar 

  10. A. Castelo, D. Nieto, C. Bao, M.T. Flores-Arias, M.V. Pérez, C. Gòmez-Reino, C. Lòpez-Gascòn, G.F. de la Fuente, Laser backwriting process on glass via ablation of metal targets. Opt. Commun. 273, 193–199 (2007)

    Article  ADS  Google Scholar 

  11. M.H. Yen, C.W. Huang, W.C. Hsu, T.H. Young, K. Zimmer, J.Y. Cheng, Crack-free micromachining on glass substrates by visible LIBWE using liquid metallic absorbers. Appl. Surf. Sci. 257, 87–92 (2010)

    Article  ADS  Google Scholar 

  12. M.K. Bhuyan, F. Courvoisier, P.A. Lacourt, M. Jacquot, L. Furfaro, M.J. Withford, J.M. Dudley, High aspect ratio taper-free microchannel fabrication using femtosecond Bessel beams. Opt. Express 18(2), 566–574 (2010)

    Article  ADS  Google Scholar 

  13. H. Ogura, Y. Yoshida, Hole drilling of glass substrates with a CO2 laser. Jpn. J. Appl. Phys. 42, 2881–2886 (2003)

    Article  ADS  Google Scholar 

  14. C.K. Chung, S.L. Lin, CO2 laser micromachined crackless through holes of Pyrex 7740 glass. Int. J. Mach. Tools Manuf. 50, 961–968 (2010)

    Article  Google Scholar 

  15. M.H. Yen, J.Y. Cheng, C.W. Wei, Y.C. Chuang, T.H. Young, Rapid cell-patterning and microfluidic chip fabrication by crack-free CO2 laser micromachining on glass. J. Micromech. Microeng. 16, 1143–1153 (2006)

    Article  ADS  Google Scholar 

  16. J. Zhao, J. Sullivan, T.D. Bennett, Wet etching study of silica glass after CW CO2 laser treatment. Appl. Surf. Sci. 225, 250–255 (2004)

    Article  ADS  Google Scholar 

  17. C.K. Chung, M.W. Liao, S.L. Lin, Effect of nonionic surfactant addition on Pyrex glass ablation using water-assisted CO2 laser processing. Appl. Phys. A 99, 285–290 (2010)

    Article  ADS  Google Scholar 

  18. N. Shen, M.J. Matthews, J.E. Fair, J.A. Britten, H.T. Nguyen, D. Cooke, S. Elhadj, S.T. Yang, Laser smoothing of sub-micron grooves in hydroxyl-rich fused silica. Appl. Surf. Sci. 256, 4031–4037 (2010)

    Article  ADS  Google Scholar 

  19. J. Jiao, X. Wang, A numerical simulation of machining glass by dual CO2 laser beams. Opt. Laser Technol. 40, 297–301 (2008)

    Article  ADS  Google Scholar 

  20. H. Tang, X. Li, Y. Gao, K. Zhu, Z. Liu, Rotating the intensity distribution of Gaussian beams propagating through paraxial ABCD systems with parallelogram apertures. Opt. Commun. 253, 38–43 (2005)

    Article  ADS  Google Scholar 

  21. C.K. Chung, Y.C. Sung, G.R. Huang, E.J. Hsiao, W.H. Lin, S.L. Lin, Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing. Appl. Phys. A 94, 927–932 (2009)

    Article  ADS  Google Scholar 

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Acknowledgements

This work is partially sponsored by National Science Council (NSC) under contract No NSC 95-2221-E006-047-MY3 and 98-2221-E-006-052-MY3. Thanks are due to the Center for Micro/Nano Science and Technology (CMNST) at National Cheng Kung University for analysis equipment support and National Center for High-performing Computing (NCHC) for the access of computation equipments.

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Correspondence to C. K. Chung.

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Chung, C.K., Lin, S.L., Wang, H.Y. et al. Fabrication and simulation of glass micromachining using CO2 laser processing with PDMS protection. Appl. Phys. A 113, 501–507 (2013). https://doi.org/10.1007/s00339-013-7555-0

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  • DOI: https://doi.org/10.1007/s00339-013-7555-0

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