Abstract
Film sandwiches, consisting of two outer layers of fluoroethylenepropylene and one middle layer of patterned porous polytetrafluoroethylene, were prepared by patterning and fusion bonding. Contact charging was conducted to render the films piezoelectric. The critical voltage to trigger air breakdown in the inner voids in the fabricated films was investigated. The piezoelectric d 33 coefficients were measured employing the quasistatic method and dielectric resonance spectrum. The results show that the critical voltage for air breakdown in the inner voids is associated with the void microstructure of the films. For the films with patterning factors of 0%, 25% and 44%, the critical values are 300, 230 and 230 kV/cm, respectively. With an increase in the patterning factor, both the piezoelectric d 33 coefficients determined from the dielectric resonance spectra and those determined from quasistatic measurements increase, which might be due to a decrease in Young’s modulus for the films. The nonlinearity of d 33 becomes increasingly obvious as the patterning factor increases.
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Acknowledgements
The authors are grateful to Professor Gerhard M. Sessler (Darmstadt University of Technology, Germany) for stimulating discussions. The financial support from Natural Science Foundation of China (NSFC, 50873078 and 51173137) and State Key Laboratory of Electrical Insulation and Power Equipment at Xi’an Jiaotong University (EIPE11203) is gratefully acknowledged.
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Lou, K., Zhang, X. & Xia, Z. Piezoelectric performance of fluor polymer sandwiches with different void structures. Appl. Phys. A 107, 613–620 (2012). https://doi.org/10.1007/s00339-012-6839-0
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DOI: https://doi.org/10.1007/s00339-012-6839-0