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Realization of KaptonTM based optical interconnect by KMnO4 wet etching

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Abstract

In the paper, based on KMnO4 wet-etching technology PDMS (polydimethylsiloxane) based flexible optical interconnect packaged with KaptonTM (Dupont) foils was successfully realized through a stable and effective bonding technology. The optical and mechanical properties of the PDMS waveguide layer remained unchanged before and after packaging with KMnO4 etched Kapton foils. The mechanical stability limit of the tested optical interconnects is determined only by the intrinsic mechanical stability of the used PDMS materials. The optical loss at 850 nm is <0.05 dB/cm even after temperature treatments up to lead-free soldering temperatures of 260°C. In addition, the main mechanism of forming a good bonding between PDMS and Kapton foil was identified and analyzed as well.

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Authors and Affiliations

  1. Technische Universität Dortmund, Fakultät für Elektrotechnik und Informationstechnik, Arbeitsgebiet Mikrostrukturtechnik (AG MST), 44227, Dortmund, Germany

    D. K. Cai & A. Neyer

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  1. D. K. Cai
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  2. A. Neyer
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Correspondence to A. Neyer.

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Cai, D.K., Neyer, A. Realization of KaptonTM based optical interconnect by KMnO4 wet etching. Appl. Phys. A 99, 783–789 (2010). https://doi.org/10.1007/s00339-010-5723-z

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  • DOI: https://doi.org/10.1007/s00339-010-5723-z

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