Skip to main content

Advertisement

SpringerLink
Log in

Residual stress and strain in CdZnTe wafer examined by X-ray diffraction methods

  • Published:
Applied Physics A Aims and scope Submit manuscript

Abstract

A non-destructive method based on X-ray diffraction was developed to measure the stress and strain in CdZnTe single crystal near the surface. From the experimental results and calculations, the residual stresses in CdZnTe single crystal were determined to be σ1=30 MPa, σ2=14 MPa, and τ12=-4 MPa, respectively. The residual stress derived from the measurement strain in CdZnTe was thought to be composed of the thermal stress, the misfit stress, and the mechanical stress. The distributions of non-uniform strain in a CdZnTe wafer are about 3.9%, while the distributions of uniform strain in the CdZnTe wafer are 0.5%, much smaller than those of the non-uniform strain.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P. Rudolph, Prog. Cryst. Growth Charact. 29, 275 (1994)

    Article  Google Scholar 

  2. A. Ward III, R.W. Hendricks, The phi analysis: a method to interpret oscillatory residual stress data, in Proc. 4th Int. Conf. Residual Stress (ICRS4), 1994, pp. 235–244

  3. G.K. Williamson, W.H. Hall, Acta Metall. 22 (1953)

  4. Society of Material Science of Japan (ed.), X Sen Zairyo Kyodo Gaku (Learning of X-Ray Material Strength) (Yokendo, Tokyo, 1973) [in Japanese]

  5. G. Simmons, H. Wang, Single Crystal Elastic Constants and Calculated Aggregate Properties: A Handbook, 2nd edn. (MIT Press, Cambridge, MA and London, 1971), p. 13

  6. H. Suzuki, K. Akita, H. Misawa, Japan. Soc. Appl. Phys. 42, 2876 (2003)

    Article  Google Scholar 

  7. R. Triboulet, Phys. Stat. Solidi C 5, 1556 (2005)

    Article  Google Scholar 

  8. C.E. Huang, D. Elwell, R.S. Feigelson, J. Cryst. Growth 69, 275 (1984)

    Article  Google Scholar 

  9. C. Parfeniuk, F. Wwinberg, I.V. Samarasekera, C. Schvezov, J. Cryst. Growth 119, 261 (1992)

    Article  Google Scholar 

  10. H. Lipson, in Symp. Internal Stresses in Metals and Alloys (London, 1948), p. 35

Download references

Author information

Authors and Affiliations

  1. School of Materials Science and Engineering, Northwestern Polytechnical University, Xi’an, 710072, P.R. China

    D. Zeng, W. Jie, T. Wang & G. Zha

Authors
  1. D. Zeng
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. W. Jie
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. T. Wang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. G. Zha
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to D. Zeng.

Additional information

PACS

02.10.Xm; 71.55.Gs; 61.10.Nz; 68.35.Gy; 81.40.Jj

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zeng, D., Jie, W., Wang, T. et al. Residual stress and strain in CdZnTe wafer examined by X-ray diffraction methods. Appl. Phys. A 86, 257–260 (2007). https://doi.org/10.1007/s00339-006-3765-z

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00339-006-3765-z

Keywords

Search

Navigation