Enhancement of deposition rate of titanium silicon oxide films on silicon using hexafluorotitanic acid by nitric acid

Abstract

The deposition of titanium silicon oxide films on silicon using hexafluorotitanic acid and boric acid as sources is much enhanced by nitric acid incorporation. The deposition delay time is almost zero. The structure of the films is titanium silicon oxide examined by Fourier transform infrared spectrometer. By current-voltage measurement, the leakage current of the as-deposited film with a thickness of 458 Å is about 7.78×10^-6 Å/cm² at the electrical field of 1 MV/cm. By capacitance-voltage measurement, the effective oxide charge of the as-deposited film is 6.31×10¹⁰ cm^-2. The static dielectric constant and refractive index are about 13 and 1.98, respectively. Compared with that without nitric acid incorporation, the lower effective oxide charge is from a sharp interface due to in-situ etching of nitric acid. The higher leakage current is from the higher deposition rate and the higher dielectric constant is from higher titanium content.