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Mechanical, thermal and dielectric properties of BDM/DBA/HBPSi composites

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Abstract

N, N′-4, 4′-bimaleimide diphenyl methane (BDM), diallylbisphenol A (DBA) and hyperbranched polysiloxane (HBPsi) are performed to fabricate the BDM/DBA/HBPSi composites by one-step method. The contents of HBPSi affecting on the mechanical, thermal and dielectric properties of the BDM/DBA/HBPSi composites are investigated. Results show that the appropriate incorporation of HBPSi into BDM/DBA not only significantly improves the toughness, but also improves the heat resistance and dielectric properties of the BDM/DBA/HBPSi composites. The outstanding comprehensive properties of BDM/DBA/HBPSi composites indicate great potentiality in fabricating advanced polymeric composites.

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Acknowledgments

The authors are grateful for the support and funding from Fund for basic research from the Northwestern Polytechnical University (No. JCY20130143), Higher School the Special Research Fund for the Doctoral Program Project (No. 20116102120044) and Open Fund from National Defense Science and Technology Key Laboratory (Grant No. 2013afdl007).

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Authors and Affiliations

  1. Department of Chemistry, School of Science, Northwestern Polytechnical University, Xi’an, Shaan xi, 710072, People’s Republic of China

    Jing Dang, Rumin Wang & Wenjing Qi

  2. AVIC the First Aircraft Institute, Yanliang, Shaan xi, 710089, People’s Republic of China

    Jing Dang, Ruixiang Lou & Zhang Zhang

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  1. Jing Dang
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  2. Rumin Wang
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  3. Ruixiang Lou
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  4. Zhang Zhang
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Correspondence to Jing Dang.

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Dang, J., Wang, R., Lou, R. et al. Mechanical, thermal and dielectric properties of BDM/DBA/HBPSi composites. Polym. Bull. 71, 787–794 (2014). https://doi.org/10.1007/s00289-014-1096-3

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  • DOI: https://doi.org/10.1007/s00289-014-1096-3

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