Abstract
This study investigates methods to improve heat transfer in electronic devices through forced convective cooling. Adequate energy dissipation from tiny elements on electronic boards is essential to prevent degradation, which can put pressure on rare material resources if repeatedly occurs. For example, abrupt expansions in the cooling channel can weaken convective energy transfer due to flow separation. To overcome this issue, in this study, porous baffles are added in different configurations to optimize hydrothermal performance in a sudden expansion. The first case involves attaching a baffle to the heated wall after the step. The conditions such as the location and dimensions of the baffle are examined. In the second case, a rectangular baffle is added to the opposite (adiabatic) wall, which significantly improves heat transfer compared to the initial state without a permeable baffle or optimal conditions of the first case. The third case replaces the rectangular baffle with a quarterly circular one, resulting in reduced pressure drop but no significant change in the Nusselt number. In the fourth case, a similar baffle is added downstream of the previous case on the upper wall to turn the flow towards the heated wall, resulting in improved convective heat transfer. Finally, the heated wall is corrugated using equilateral permeable triangles in the fifth case, leading to a local Nusselt number increase of 6.5 times in the final case (including all modifications) with respect to the initial bare channel. Mini-baffles are also shown to enhance heat transfer considerably in small Reynolds numbers. Overall, optimizing baffle configurations can effectively improve heat transfer in electronic devices, reducing their degradation and conserving rare material resources for the future.
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Talaei, H., Bahrami, HR. Backward-facing step heat transfer enhancement: a systematic study using porous baffles with different shapes and locations and corrugating after step wall. Heat Mass Transfer 59, 2213–2230 (2023). https://doi.org/10.1007/s00231-023-03401-8
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DOI: https://doi.org/10.1007/s00231-023-03401-8