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Numerical study of conjugate heat transfer in rectangular microchannel heat sink with Al2O3/H2O nanofluid

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Abstract

In the present paper, conjugate heat transfer approach has been used to numerically study laminar forced convective heat transfer characteristics of Al2O3/H2O nanofluid flowing in a silicon microchannel heat sink (MCHS) of rectangular cross-section using thermal dispersion model. Results are presented in terms of thermal resistance that characterizes MCHS performance. It is observed that use of nanofluid improves MCHS performance by reducing fin (conductive) thermal resistance.

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Abbreviations

C*:

Constant, in Eq. 7

C p :

Specific heat (J/kg K)

d h :

Hydraulic diameter (μm) (10−6 m)

D :

Thermal dispersion coefficient (W/mK)

f :

Skin friction coefficient

h :

Heat transfer coefficient (HTC) (W/m2K)

k :

Thermal conductivity (W/mK)

L :

Length of MCHS (mm) (10−3 m)

L e :

Entrance length (mm)

p :

Pressure (Pa)

Δp :

Pressure drop (kPa) (103 N/m2)

P :

Perimeter of microchannel (μm)

Pe :

Peclet number, Pe = d h v avg/(k/ρC p)nf

Pow:

Pumping power (W)

q″:

Heat flux (MW/m2)

Q :

Dissipated power (W)

Re :

Reynolds number, Re = d h v avg/(μ/ρ)nf

t b :

Substrate thickness on heated side of MCHS (μm)

T :

Temperature (K)

T s :

Substrate (wafer) temperature (K)

v :

Velocity (m/s)

V :

Volumetric flowrate (cc/s) (10−6 m3/s)

w ch :

Width of microchannel (μm)

w fin :

Width of microchannel wall (fin) (μm)

W :

Width of MCHS (mm)

3D:

Three-dimensional

α :

Surface area multiplication factor

β :

Ratio of nanolayer thickness to nanoparticle radius, in Eq. 5

ϕ :

Volume fraction of nanoparticles

μ :

Viscosity (kg/ms)

ρ :

Density (kg/m3)

Ω:

Computational domain

θ :

Thermal resistance (K/W)

θ cond :

Thermal resistance due to substrate thickness on heated side of MCHS (K/W)

ψ :

Synergy angle (degree)

avg:

Average

axial:

Axial

bf:

Base fluid

exit:

Exit (outlet)

flow:

Flow (convective)

fin:

Fin/wall (conductive)

in:

Inlet

max:

Maximum

net:

Overall

nf:

Nanofluid

np:

Nanoparticle

s:

Substrate (solid silicon wafer)

wall:

Wall

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Authors and Affiliations

  1. Department of Chemical Engineering, Indian Institute of Technology Kharagpur, Kharagpur, 721302, West Bengal, India

    P. Bhattacharya, A. N. Samanta & S. Chakraborty

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  1. P. Bhattacharya
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  2. A. N. Samanta
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  3. S. Chakraborty
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Correspondence to P. Bhattacharya.

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Bhattacharya, P., Samanta, A.N. & Chakraborty, S. Numerical study of conjugate heat transfer in rectangular microchannel heat sink with Al2O3/H2O nanofluid. Heat Mass Transfer 45, 1323–1333 (2009). https://doi.org/10.1007/s00231-009-0510-0

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  • DOI: https://doi.org/10.1007/s00231-009-0510-0

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