Abstract
An experimental investigation has been carried out to determine the optimum spacing ratio among the heated elements in the cooling of electronic package. Three-by-three heated resistors with different spacing ratio are mounted on the substrate that in turn rests in a tunnel. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option, and a better thermal performance could be obtained when the center-to-center distances between the resistors follow a geometric series. At Re=800, when the spacing ratio among the heated resistors is 1.8, the highest temperature can decrease 8.24% and the temperature difference among resistors can reduce about 27.62% compared to that of the equi-spaced arrangement.
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Received on 5 June 2000
Funding support from The Hong Kong Polytechnic University under Grant No. G-YB87 is gratefully acknowledged.
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Chen, S., Liu, Y. An optimum spacing problem for three-by-three heated elements mounted on a substrate. Heat and Mass Transfer 39, 3–9 (2002). https://doi.org/10.1007/s00231-001-0286-3
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DOI: https://doi.org/10.1007/s00231-001-0286-3