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Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface

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Abstract

In the process of ultra-precision grinding, the dynamic characteristics of the aerostatic spindle system are important factors affecting the machined surface morphology. In order to study the influence of the dynamic characteristics of the spindle system on the medium frequency waviness error of the silicon wafer surface, this paper first establishes a dynamic model of the aerostatic spindle system considering the grinding force and the eccentricity of the spindle rotor based on Newton’s law and the angular momentum law, analyzes the dynamic response and frequency characteristics of the spindle system, and conducts modal tests on the spindle system to verify the accuracy of the dynamic model. Then, the power spectral density analysis of the surface morphology of the silicon wafer after grinding is carried out, and the frequency components of the intermediate frequency band of the silicon wafer surface are obtained. Compared with the characteristic frequency of the spindle system and the vibration displacement curve of the end, it is found that the dynamic characteristics of the aerostatic spindle system are the main reason for the medium frequency waviness error on the surface of the silicon wafer. Finally, an optimization scheme for structural improvement of the aerostatic spindle system is given. Through the finite element analysis of the grinding machine, it is found that the vibration displacement of the spindle end after optimization is reduced by 52.8 % compared with that before optimization, which shows that the optimization scheme is effective and provides a reference for the structural design of the aerostatic spindle system.

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Data used to support the findings of this study are available from the corresponding author upon request.

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Funding

This research is financially supported by the Program of National Natural Science Foundation of China (51991372), The Opening Foundation of Key Laboratory for Precision and Non-traditional Machining Technology (No. B202102) and The Key Support Plan for Foreign Experts (No. ZCZD2022002L).

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Authors and Affiliations

  1. State Key Laboratory of High-Performance Precision Manufacturing, Dalian University of Technology, Dalian, 116024, People’s Republic of China

    Meng Li, Xianglong Zhu, Renke Kang, Jiasheng Li & Jiahui Xu

Authors
  1. Meng Li
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  2. Xianglong Zhu
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  3. Renke Kang
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  4. Jiasheng Li
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  5. Jiahui Xu
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Contributions

RK contributed significantly to analysis and manuscript preparation;

XZ contributed to the conception of the study;

JL performed the experiment;

ML performed the data analyses and wrote the manuscript;

JX helped perform the analysis with constructive discussions;

Corresponding author

Correspondence to Xianglong Zhu.

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Li, M., Zhu, X., Kang, R. et al. Effect of aerostatic spindle dynamic characteristics on the medium frequency waviness error of silicon wafer surface. Int J Adv Manuf Technol 130, 2587–2600 (2024). https://doi.org/10.1007/s00170-023-12755-6

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  • DOI: https://doi.org/10.1007/s00170-023-12755-6

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