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Study into grinding force in back grinding of wafer with outer rim

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Abstract

Back grinding of wafer with outer rim (BGWOR) is a new method for carrier-less thinning of silicon wafers. At present, the effects of process parameters on the grinding force remain debatable. Therefore, a BGWOR normal grinding force model based on grain depth-of-cut was established, and the relationship between grinding parameters (wheel infeed rate, wheel rotational speed, and chuck rotational speed) and normal grinding force was discussed. Further, a series of experiments were performed to verify the BGWOR normal grinding force model. This study proves that the BGWOR normal grinding force is related to the rotational direction of the wheel and chuck, and the effect of grinding mark density on the BGWOR normal grinding force cannot be ignored. Moreover, this study provides methods for reducing the grinding force and optimizing the back thinning process of the silicon wafer.

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Abbreviations

d g-max :

The maximum grain depth-of-cut

dl :

Length of grinding line

dV :

Removal volume of material

f :

Wheel infeed rate

f r :

Ideal infeed depth per wheel revolution

\(f_{\text{r}}^{\prime }\) :

Actual infeed depth per wheel revolution

k :

Chip thickness coefficient

n s :

Wheel rotational speed

n w :

Chuck rotational speed

r :

Radial distance of wafer

t r :

Time per wheel revolution

z = 0:

End face of wheel

z w :

Wafer surface

rdr/dl :

Reciprocal of grinding marks density

A s :

Equivalent cutting area of single abrasive grain

BGWOR:

Back grinding of wafer with outer rim

E 1 :

Young’s modulus of wafer

E 2 :

Young’s modulus of diamond

F :

Normal force for a single abrasive grain

F c :

Normal cutting force

F s :

Normal sliding force

F total :

Total normal grinding force

L :

Circumference of grinding wheel

N cut :

Number of effective cutting grains

R g :

Radius of abrasive grain

SSD:

Depth of subsurface damage

W :

Width of grinding wheel segment

α :

Overlap coefficient

γ v :

Grain volume ratio

υ 1 :

Poisson’s ratio of wafer

υ 2 :

Poisson’s ratio of diamond

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Acknowledgements

The authors gratefully acknowledge the financial support from the National Key Research and Development Program of China (Grant No. 2016YFB1102205) and the National Natural Science Foundation of China (Grant No. 51775084).

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Authors and Affiliations

  1. Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, 116024, People’s Republic of China

    Xiang-Long Zhu, Yu Li, Zhi-Gang Dong, Ren-Ke Kang & Shang Gao

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  1. Xiang-Long Zhu
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  2. Yu Li
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  3. Zhi-Gang Dong
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  4. Ren-Ke Kang
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  5. Shang Gao
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Correspondence to Ren-Ke Kang.

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Zhu, XL., Li, Y., Dong, ZG. et al. Study into grinding force in back grinding of wafer with outer rim. Adv. Manuf. 8, 361–368 (2020). https://doi.org/10.1007/s40436-020-00316-z

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  • DOI: https://doi.org/10.1007/s40436-020-00316-z

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