Abstract
A planetary-type cluster magnetorheological polishing device with a rotating magnetic field was proposed to solve the problems of abrasive accumulation and low polishing efficiency caused by the untimely restoration of the conventional magnetic chain. Considering the microstructural deformation and squeeze-strengthening effect of magnetorheological polishing fluid, a material removal rate model was established based on the principle of fluid dynamic pressure and verified by experiments. The relationships between material removal rate or roughness and processing parameters were confirmed by multiple linear regression analyses, respectively. And the processing parameters optimization was made by linear weighting method under the premise of establishing the evaluation system. The results show that the eccentricity and angular velocity ratio are proportional and inversely proportional to MRR, respectively. When the polishing fluid is squeezed, the material removal rate can be significantly increased from 7 to 21 nm/min, but the roughness will be reversed at a gap of less than 0.9 mm. After the optimization of processing parameters, the workpiece roughness after rough and fine polishing was reduced from 1.079 μm and 1.083 μm to 0.346 μm and 0.184 μm, with a reduction of 67.9% and 83.01%.
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Funding
This work was supported by the Natural Science Foundation Project of Chongqing Science and Technology Commission (cstc2020jcyj-msxmX0402). Author Song Chen has received research support from Chongqing Science and Technology Commission.
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All authors contributed to the study conception and design. Material preparation, data collection, and analysis were performed by Song Chen and Tianwu Cai. The first draft of the manuscript was written by Song Chen and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.
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Chen, S., Cai, T. Investigations on process parameters of cluster magnetorheological polishing in a planet motion model. Int J Adv Manuf Technol 128, 5477–5490 (2023). https://doi.org/10.1007/s00170-023-12258-4
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DOI: https://doi.org/10.1007/s00170-023-12258-4