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Study on surface defect formation mechanism in ultrasonic vibration-assisted grinding of SiCp/Al composites

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Abstract

Ultrasonic vibration-assisted grinding (UVAG) is an effective method for high-quality and efficient processing of advanced composite materials. However, the material removal and defect formation mechanism of SiC particle-reinforced aluminum matrix (SiCp/Al) composites in UVAG processing are still unclear. This limits the application of UVAG in composite processing. In this work, a microstructure-based finite element model, in which the properties of SiC particle, Al matrix, and the interfacial layer between SiC particle and Al matrix are considered, has been developed in order to more accurately describe the deformation and failure behavior of SiCp/Al composites in the ultrasonic vibration-assisted grinding process. The influences of complex interactions between tool, particle, and matrix under different tool-workpiece contact modes on material removal and surface defect formation mechanism are analyzed based on the proposed model. Simulation results show that groove and pit defects are more likely to occur in the tool-workpiece continuous contact mode while voids and particle fractures often appear in the tool-workpiece intermittent contact mode. The validity of the proposed model is verified by the corresponding ultrasonic vibration-assisted scratching experiments in terms of surface morphology, defect characteristics, and scratching force. Experimental results are found to correspond well with the outcome of the simulation. The findings reported in this work provide a theoretical basis for exploring effective methods to reduce machining defects and improve the quality of machined surfaces.

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Abbreviations

UVAG:

Ultrasonic vibration-assisted grinding

SiCp/Al:

Silicon carbide particle-reinforced aluminum matrix composites

UVAM:

Ultrasonic vibration-assisted machining

CG:

Conventional grinding

RUVAS:

Rotary ultrasonic vibration-assisted scratch

\({v}_{s}\) :

Cutting speed

\(f\) :

Frequency of ultrasonic vibration

\(A\) :

Ultrasonic amplitude

\(\theta\) :

Top angle of the abrasive grain

\(\sigma\) :

Von Mises plastic equivalent stress

\(\overline\sigma\)  :

Stress triaxiality

\(\varepsilon\) :

Equivalent plastic strain

\(\dot{\varepsilon }\) :

Plastic strain rate

\({\dot{\varepsilon }}_{0}\) :

Reference strain rate

\({{\varepsilon }_{f}}^{pl}\) :

Critical equivalent plastic strain

\(\Delta {\overline{\varepsilon }}^{pl}\) :

Increment of equivalent plastic strain

T :

Temperature of material

T room :

Room temperature

T melt :

Melting temperature

D :

Damage parameter in J-C

a,b,n,c,m :

J-C strength model constants for the Al2024

d 1, d 2, d 3, d 4, d 5 :

J-C damage constants for the Al2024

\({\sigma }^{*}\) :

Normalized von Mises equivalent stress

\({\sigma }_{i}^{*}\) :

Normalized intact equivalent stress

\({\sigma }_{f}^{*}\)  :

Normalized fractured equivalent stress

\(\dot{\sigma }\) :

Actual von Mises equivalent stress

\({\sigma }_{\text{HEL}}\) :

Equivalent stress at the Hugoniot elastic limit

P :

Actual pressure

\({P}^{*}\) :

Normalized pressure

\({P}_{\text{HEL}}\) :

Pressure at the Hugoniot elastic limit

\({T}^{*}\) :

Normalized maximum tensile hydrostatic pressure

\(\dot{T}\) :

Maximum tensile pressure

\({\dot{\varepsilon }}^{*}\) :

Dimensionless strain rate

\({\overline{\varepsilon }}_{f}^{pl}(P)\) :

Equivalent plastic strain to fracture under constant pressure

\({D}^{*}\) :

Damage parameter in JH-2

\(\omega\) :

Damage initiation parameter

\({A}^{*}\),\({B}^{*}\),\({C}^{*}\),\(M\),\(N\),\({D}_{1}\),\({D}_{2}\) :

Material parameters of SiC for the JH-2 model

\({K}_{1}\),\({K}_{2}\),\({K}_{3}\) :

Constants of the JH-2 model

\(\rho\) :

Current density

\(\rho_0\)  :

Reference density

\({t}_{n}^{0}\),\({t}_{s}^{0}\),\({t}_{t}^{0}\) :

Peak values of the nominal stress

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Funding

This work was supported by the National Natural Science Foundation of China (Grant No. 51975153).

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Authors and Affiliations

  1. School of Mechatronic Engineering, Harbin Institute of Technology, Harbin, 150001, China

    Haotao Wang & Ming Zhou

  2. Research Center of Laser Fusion, China Academy of Engineering Physics, Mianyang, 621900, China

    Haijun Zhang

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  1. Haotao Wang
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Contributions

Haotao Wang: conceptualization, simulation modeling, software, experimental work, writing (original draft preparation), reviewing, and editing.

Haijun Zhang: investigation, software, and writing (reviewing and editing).

Ming Zhou: conceptualization, funding acquisition, supervision, and writing (reviewing and editing).

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Correspondence to Ming Zhou.

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Wang, H., Zhang, H. & Zhou, M. Study on surface defect formation mechanism in ultrasonic vibration-assisted grinding of SiCp/Al composites. Int J Adv Manuf Technol 129, 375–397 (2023). https://doi.org/10.1007/s00170-023-12253-9

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