Abstract
The dynamic temperature condition during grinding processing is one of the key factors for the surface quality, such as micro structuring change and softened deformation on the workpiece’s surface. Many researchers have studied the grinding temperature field. However, few studies focus on the correlation between the temperature and vibration signal. In this paper, the correlation between the temperature and vibration signal was discussed; then, a novel method to monitor the grinding temperature by the vibration signal analysis was proposed. A simplified damped spring-mass model, moving heat flux model, was developed, based on which simulation study on the generative vibration and temperature field under dry grinding was performed. A dry grinding experiment on AISI1045 was conducted, and relative error of the experimental temperature and simulation was 7.2%. The short-time Fourier transform (STFT) and the principal component analyses (PCA) are used for vibration signal feature extraction. Then, the correlation coefficient between the grinding temperature and the vibration signal under different cutting depths was 0.877, and under different feeding speeds was 0.917, demonstrating the consistency. The experimental result conforms to the theoretical analysis, and it indicates the feasibility of this method.
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This project is supported by the National Natural Science Foundation of China (Grant No. 52175383)
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Xiangna Kong and Shichao Xiu contributed to the conception of the study; Cong Sun and Hong Yuan designed the experimental plan; Xiannan Zou and Yingbo Zhao processed and analyzed the experimental data; Xiangna Kong wrote the original draft and Shichao Xiu supervised the project and reviewed and edited the article.
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Kong, X., Yuan, H., Zou, X. et al. A dynamic temperature condition monitoring method by vibration signal in grinding process. Int J Adv Manuf Technol 131, 2497–2507 (2024). https://doi.org/10.1007/s00170-023-11797-0
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DOI: https://doi.org/10.1007/s00170-023-11797-0